Positive Bias Temperature Instability Degradation of InGaAs N-Mosfets with Al2O3 Gate Dielectric

G. F. Jiao,W. Cao,Y. Xuan,D. M. Huang,P. D. Ye,M. F. Li
DOI: https://doi.org/10.1109/iedm.2011.6131621
2011-01-01
Abstract:CP measurements show that PBTI stress induced interface trap area density ΔNit in InGaAs/Al2O3 n-MOSFET is very small and has power law time evolution At0.22 in the stress phase, and is partially recovered in the recovery phase. However the DC Is-Vg measurements show large degradations of negative ΔVg and sub-threshold swing S in the sub-threshold region and are recovered in the recovery phase, also show degradation of positive ΔVg in the on-current region and continuing degradation in the recovery phase until reaching a stable state. The Is-Vg degradation is mainly contributed by generation of near interface slow oxide traps under stress with recoverable donor trap energy density ΔDSOXDONOR in the InGaAs energy gap with a tail extended to the conduction band energy, and permanent acceptor trap energy density ΔDSOXACCEPTOR in the conduction band energy with a tail extended to the energy gap. This trap model explains all experimental details perfectly.
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