Analysis of CMOS-compatible Lateral Insulated Base Transistors

EMS NARAYANAN,GAJ AMARATUNGA,WI MILNE,JI HUMPHREY,Q HUANG
DOI: https://doi.org/10.1109/16.85159
1991-01-01
Abstract:We describe the performance of various Lateral Insulated Base Transistors (LIBT's) fabricated with a 2.5-mu-m digital CMOS-compatible High Voltage Integrated Circuit (HVIC) process. Structural modifications have been proposed to the LIBT's reported to date, in order to improve their on-state performance. The modifications have been achieved with the use of charge-controlled n+ buried layers incorporated within the device structures. These LIBT's are implemented with a novel HVIC process which is based on a 2.5-mu-m digital CMOS fabrication sequence. This HVIC process utilizes just three additional steps carried out prior to the CMOS fabrication sequence. An important feature of this HVIC process is the use of a 400-angstrom gate oxide, which makes the power devices fully compatible with the low-voltage digital circuits. During this work, we have obtained a specific on-resistance of 0.016-OMEGA . cm2 and a turn-off delay of 90 ns in an improved LIBT structure which is capable of withstanding up to 250 V.
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