Abstract:Introducing ultrasound irradiation to the electrodeposition process can significantly improve the physical and chemical properties of deposited films. Meanwhile, the beneficial effects from supercritical-CO2, such as high diffusivity, high permeability, low surface tension, etc., would improve the electrodeposition process with better surface quality. In the shed of the light, the present work deals with the preparation of copper (Cu) films using the integrated techniques, i.e., ultrasonic-assisted supercritical-CO2 (US-SC-CO2) electrodeposition approach. For comparison, Cu films were also prepared by normal supercritical-CO2 (SC-CO2) and conventional electrodeposition methods. To investigate the characteristics of Cu films, surface morphology analysis, roughness analysis, X-ray diffraction studies (XRD), Linear polarization, electrochemical impedance spectroscopy (EIS), and cyclic voltammetry (CV) were performed. In this work, EIS analysis was utilized for interfacial charge transfer resistance analysis with 5 mM [Fe(CN)6]-3/-4 redox system and corrosion analysis with 3.5 wt% NaCl solution. The observed results revealed that the film prepared with the US-SC-CO2 method have superior properties than those produced by normal SC-CO2 and conventional methods. Due to the combination of US-SC-CO2, the cavitation implosion occurs rapidly that enriches the deposited film quality, such as sufficient grain size, smoother surface, enhanced corrosion resistance, and charge carrier dynamics. On the other hand, the ultrasound effect with SC-CO2 helped to remove the weakly adhered metal ions on the electrode's surface.

Enhanced Cvd of Copper Films on Self-Assembled Monolayers As Ultrathin Diffusion Barriers

Characterization of Chemical Vapor Deposited Copper Films on Mercaptan Self-Assembled Monolayer Diffusion Barriers

Study on Chemical Vapor Deposited Copper Films on Cyano and Carboxylic Self-Assembled Monolayer Diffusion Barriers

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Site-selective deposition of copper by controlling surface reactivity of SAMs with UV-irradiation

Effects of amino-terminated self-assembled monolayers on nucleation and growth of chemical vapor-deposited copper films

Effects of Terminated Functional Groups of Self-assembled Monolayers on Chemical Vapor-deposited Copper Films

In situ functionalized self-assembled monolayer surfaces for selective chemical vapor deposition of copper

Chemical Vapor Deposition Mechanism of Copper Films on Silicon Substrates

Self-assembled monolayer of ammonium pyrrolidine dithiocarbamate on copper detected using electrochemical methods, surface enhanced Raman scattering and quantum chemistry calculations

CATHODICALLY ELECTROCHEMICAL-ASSISTED DEPOSITION AND PROTECTIVE PROPERTIES OF SILANE FILMS

Modification copper surface by micron thickness film via thiol-based click reaction

Preparation and study of complex self-assembled film as a super-thin barrier on silver

Influence of ultrasonic combined supercritical-CO2 electrodeposition process on copper film fabrication: Electrochemical evaluation

Electrodeposition of Superhydrophobic Cu Film on Active Substrate from Deep Eutectic Solvent

Copper Metallization of Low-Dielectric-constant A-Sicof Films for ULSI Interconnects

Inhibition of Copper Corrosion in Sodium Chloride Solution by the Self-Assembled Monolayer of Sodium Diethyldithiocarbamate

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

Diffusion and Adhesion Properties of Cu Films on Polyimide Substrates

Study on Preparation Method for Short-Chain Alkylsiloxane Self-Assembled Monolayers and the Diffusion Behavior of Copper on Silica Surfaces

In Situ Click-Assembling Monolayers on Copper Surface with Enhanced Corrosion Resistance