Abstract:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Site-selective deposition of copper by controlling surface reactivity of SAMs with UV-irradiation

In situ functionalized self-assembled monolayer surfaces for selective chemical vapor deposition of copper

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Enhanced Cvd of Copper Films on Self-Assembled Monolayers As Ultrathin Diffusion Barriers

Effects of amino-terminated self-assembled monolayers on nucleation and growth of chemical vapor-deposited copper films

Effects of Terminated Functional Groups of Self-assembled Monolayers on Chemical Vapor-deposited Copper Films

Electroless metallization of hydrogen-terminated Si(100) surface functionalized by viologen

Selective Hydrogenation of Dimethyl Maleate to Tetrahydrofuran over Cu/SiO2 Catalyst: Effect of Cu+ on the Catalytic Performance

Controlled Grafting Of Well-Defined Functional Polymers On Hydrogen-Terminated Silicon Substrates: Relevance To Adhesion Of Electrolessly-Deposited Copper

Characterization of Chemical Vapor Deposited Copper Films on Mercaptan Self-Assembled Monolayer Diffusion Barriers

Chemical Vapor Deposition Mechanism of Copper Films on Silicon Substrates

Study on Chemical Vapor Deposited Copper Films on Cyano and Carboxylic Self-Assembled Monolayer Diffusion Barriers

Improving Area-Selective Molecular Layer Deposition by Selective SAM Removal

Self-assembled Monolayers of 3-MPT and Its Mixed-Monolayers with Alkanethiol on Silver: Studies by XPS and Electrochemical Methods

Study on Preparation Method for Short-Chain Alkylsiloxane Self-Assembled Monolayers and the Diffusion Behavior of Copper on Silica Surfaces

Scanning electrochemical microscopy studies of micropatterned copper sulfide (Cu(x)S) thin films fabricated by a wet chemistry method

Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process

Preparation and Characterization of Copper Oxide Thin Films Deposited by Filtered Cathodic Vacuum Arc

Preparation and study of complex self-assembled film as a super-thin barrier on silver

Self-assembled monolayer of ammonium pyrrolidine dithiocarbamate on copper detected using electrochemical methods, surface enhanced Raman scattering and quantum chemistry calculations

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives