Abstract:This article discusses advanced developments and applications of chemical mechanical polishing (CMP) published recently in the selected papers indexed by Web of Science. The topics covered are advances in slurry and abrasives, pads and conditioning, CMP for semiconductor device manufacturing, CMP for other applications, modeling and simulations, and CMP with ultrasonic vibrations, lasers, photocatalysts, or UV lamps. Nonspherical abrasive particles have been developed for CMP, resulting in increased material removal rates (MRRs). Advanced conditioning methods have been proposed to uniformly generate pad surface shapes. Fixed abrasive CMP has advantages with higher MRRs. New models for designing the pad and conditioner have been proposed, and more uniform pad shapes can be obtained. Integrated advanced process control improves the wafer-to-wafer variation. Dental implants treated by CMP perform equally or better than the baseline-machined implants and the biphasic calcium phosphate-treated implants. The slurry distribution and the abrasive behavior can be simulated by means of multiphase modeling. Molecular dynamics simulations can explore the mechanism of CMP. CMP of wafers can be simulated using an atomic force microscope with its tapping mode. Theoretical models have been developed to calculate removal depths, study the chemical action in CMP, and explore the crystal orientation effects. CMP assisted by ultrasonic vibrations increases CMP MRRs and lowers the roughness of polished surfaces. CMP assisted by using UV lamp power, femtosecond lasers, or photocatalysts enhances CMP MRRs.

Amorphous Diamond Dresser for CMP Fixed Abrasives Pad

Analysis of Fixed Abrasive Pads with a Nano-Sized Diamond for Silicon Wafer Polishing

Study on the CMP Pad Life with Its Mechanical Properties

Friction and wear characteristics of agglomerated diamond abrasives and lapping performance of fixed agglomerated diamond pads

A novel agglomerated diamond abrasive with excellent micro-cutting and self-sharpening capabilities in fixed abrasive lapping processes

Factors influencing the dressing rate of chemical mechanical polishing pad conditioning

In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains

Lapping performance of mixed-size agglomerated diamond abrasives in fixed abrasives pads

Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers

The CMP by Polishing with GiP Dressed by BODD

Tribological effects of loose alumina abrasive assisted sapphire lapping by a fixed agglomerated diamond abrasive pad (FADAP)

A Study on Polishing Silicon Wafers by Hot Melt Adhesive Polishing Pads with Abrasives Coated in Different Ways

Recent developments and applications of chemical mechanical polishing

The Deterioration Characteristics and Mechanism of Polishing Pads in Chemical Mechanical Polishing of Fused Silica

A novel slurry for chemical mechanical polishing of single crystal diamond

Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad

Improvement and Application of Pad Conditioning Accuracy in Chemical Mechanical Polishing

Process Optimization of Lapping Sapphire Substrate with Fixed Diamond Abrasive Pad

Wear phenomena in chemical mechanical polishing

Lapping of sapphire using developed clusters of diamond and ceria chemically active abrasives