Abstract:Sapphire single crystal has great potential applications in the semiconductor field. Due to its brittle characteristics. Crack failure on ultra-thin sapphire surface were prone to happen using tradition paraffin bonding clamping method during double-side processing, which severely restricted its processing efficiency. Thus, for overcoming the problem, the layer stacked clamping (LSC) method was proposed by using van der Waals forces and capillary forces that caused by dropping a liquid between workpiece and baseplate. A series of experiments were conducted for studying the characteristic of layer stacked clamping (LSC) method on polishing ultrathin sapphire wafer with double-side polishing machine. A self-made friction force test platform was built for learning the friction force between sapphire wafer and baseplate with different baseplate (stainless steel, cast iron, and aluminum alloy) and different baseplate surface roughness (Ra 3.6 nm, 68.2 nm, 210.1 nm, and 517.9 nm). Single-factor polishing experiments were carried out on baseplate with different flatness (PV value 5.3 μm, 9.8 μm, 19.9 μm, and 29.7 μm) and different thicknesses (0.082 mm, 0.104 mm, and 0.119 mm). The double-side polishing experiments were carried out to compare the polishing performance on the ultrathin sapphire polishing between LSC method and traditional paraffin bonding method. The results show that the friction forces of stainless steel and iron increase under the adsorption of droplets. Stainless steel performs higher friction force and is more suitable for making the baseplate. The inner fringe of limiter was cut off by the edge of the sapphire wafer, and a slope was thereby formed. According to polishing results, the LSC method has a higher efficiency on the clamping wafers than traditional paraffin bonding method. The surface roughness, flatness, and material removal rates are better than paraffin bonding. Finally, a smooth surface with a surface roughness (Sa) of 1.1 nm and flatness (PV) of 0.988 μm was obtained by the LSC method, significantly improving the clamping and processing efficiency of ultra-thin sapphire.

Tribological effects of loose alumina abrasive assisted sapphire lapping by a fixed agglomerated diamond abrasive pad (FADAP)

In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains

A novel agglomerated diamond abrasive with excellent micro-cutting and self-sharpening capabilities in fixed abrasive lapping processes

Lapping performance of mixed-size agglomerated diamond abrasives in fixed abrasives pads

Friction and wear characteristics of agglomerated diamond abrasives and lapping performance of fixed agglomerated diamond pads

Effect of Abrasive Grain Concession on Micromechanical Behavior of Lapping Sapphire by FAP

Lapping of sapphire using developed clusters of diamond and ceria chemically active abrasives

Effect of particle size on friction signal characters when lapping quartz glass with fixed abrasive pad

Amorphous Diamond Dresser for CMP Fixed Abrasives Pad

Research on the Fixed-Abrasive Lapping Process of Polycrystalline Aluminum Nitride

Effect of EDTA-modified alumina composite abrasive on the CMP performance of sapphire substrate

An Exploration of the Influence of Abrasive Water Jet Pressure on the Friction Signal Characteristics of Fixed Abrasive Lapping Quartz Glass Based on HHT

Orthogonal experimental study on the influence of machining parameters on flat lapping of sapphire substrate

Performance assessment of ultrathin sapphire wafer polishing with layer stacked clamping (LSC) method

AFM and XPS Studies on Material Removal Mechanism of Sapphire Wafer During Chemical Mechanical Polishing (CMP)

A Novel Lapping Process for Single-Crystal Sapphire Using Hybrid Nanoparticle Suspensions

Influence of SiO 2 –ZnO mixed soft abrasive on tribological behavior and polishing performance of sapphire wafer

Preparation of α-alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate

A study on mechanism of sapphire polishing using the diamond abrasive by molecular dynamics

Influence of holding time on the interfacial solid solution and mechanical properties of agglomerated white fused alumina abrasives

Theoretical and experimental investigation on surface generation and subsurface damage in fixed abrasive lapping of optical glass