Abstract:Sapphire single crystal has great potential applications in the semiconductor field. Due to its brittle characteristics. Crack failure on ultra-thin sapphire surface were prone to happen using tradition paraffin bonding clamping method during double-side processing, which severely restricted its processing efficiency. Thus, for overcoming the problem, the layer stacked clamping (LSC) method was proposed by using van der Waals forces and capillary forces that caused by dropping a liquid between workpiece and baseplate. A series of experiments were conducted for studying the characteristic of layer stacked clamping (LSC) method on polishing ultrathin sapphire wafer with double-side polishing machine. A self-made friction force test platform was built for learning the friction force between sapphire wafer and baseplate with different baseplate (stainless steel, cast iron, and aluminum alloy) and different baseplate surface roughness (Ra 3.6 nm, 68.2 nm, 210.1 nm, and 517.9 nm). Single-factor polishing experiments were carried out on baseplate with different flatness (PV value 5.3 μm, 9.8 μm, 19.9 μm, and 29.7 μm) and different thicknesses (0.082 mm, 0.104 mm, and 0.119 mm). The double-side polishing experiments were carried out to compare the polishing performance on the ultrathin sapphire polishing between LSC method and traditional paraffin bonding method. The results show that the friction forces of stainless steel and iron increase under the adsorption of droplets. Stainless steel performs higher friction force and is more suitable for making the baseplate. The inner fringe of limiter was cut off by the edge of the sapphire wafer, and a slope was thereby formed. According to polishing results, the LSC method has a higher efficiency on the clamping wafers than traditional paraffin bonding method. The surface roughness, flatness, and material removal rates are better than paraffin bonding. Finally, a smooth surface with a surface roughness (Sa) of 1.1 nm and flatness (PV) of 0.988 μm was obtained by the LSC method, significantly improving the clamping and processing efficiency of ultra-thin sapphire.

A Novel Lapping Process for Single-Crystal Sapphire Using Hybrid Nanoparticle Suspensions

Nanomaterials and Equipment for Chemical-Mechanical Polishing of Single-Crystal Sapphire Wafers

Polishing performance and mechanism of a water-based nanosuspension using diamond particles and GO nanosheets as additives

A Method for Preparing Surface Sub-Microstructures on Sapphire Surfaces Using Femtosecond Laser Processing Technology

Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire

Lapping of sapphire using developed clusters of diamond and ceria chemically active abrasives

Chemical mechanical polishing for sapphire wafers using a developed slurry

Preparation of a Novel Catalyst (sofeiii) and Its Catalytic Performance Towards the Removal Rate of Sapphire Substrate During CMP Process

Performance assessment of ultrathin sapphire wafer polishing with layer stacked clamping (LSC) method

Machining performance and material removal mechanism of sapphire with novel polishing slurry

Sub-diffraction-limit fabrication of sapphire by femtosecond laser direct writing

Fe-Nx/C Assisted Chemical–mechanical Polishing for Improving the Removal Rate of Sapphire

Effect of different grinding strategies on subsequent polishing processes of sapphire

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Experimental Study of Ultrasonic Vibration Assisted Chemical Mechanical Polishing for Sapphire Substrate

Orthogonal experimental study on the influence of machining parameters on flat lapping of sapphire substrate

An Experimental Investigation of Sapphire Grinding by Porous and Vitrified M0.5/1.5 Diamond Grinding Wheel

Study on the Fabrication and Grinding Performance of the Self-sharpening Cr2O3 Gel Abrasive Tool

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Property Research on Nano-Micro Crystalline Diamond Coated Tools Lapping Sapphire Wafer

Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing