Study on the Fabrication and Grinding Performance of the Self-sharpening Cr2O3 Gel Abrasive Tool
Kaiping Feng,Liang Zhao,Binghai Lyu,Lanxing Xu,Yanzhang Gu
DOI: https://doi.org/10.1007/s12541-024-00958-0
IF: 2.0411
2024-01-24
International Journal of Precision Engineering and Manufacturing
Abstract:This paper proposes a chromium oxide (Cr 2 O 3 ) gel abrasive tool with the coated aluminum nitride (AlN) powder to give the tool with self-sharpening ability. The SiO 2 /AlN powder (S/A powder) is prepared through the sol–gel method. Effect of acetic acid solution content on the Tetraethyl orthosilicate (TEOS) hydrolysis reaction is explored. Effect of sintering temperature on the moisture resistance of the S/A powder are studied. The viscosity experiments, porosity tests, pre-grinding experiments and hardness tests are conducted to test the properties of the abrasive tool. The force–displacement curves are tested to evaluate the uniformity of the tool. The grinding effect on the sapphire substrate of tool with S/A powder, normal abrasive tool and tool with pore forming agent are compared. Results show that the SiO 2 gel has great stability when the acetic acid solution content reached 0.6 g, and the gel does not crack after a week's rest, which is suitable for the coating of the AlN powder. In the powder sintering experiment, 700 °C is found to be the optimal sintering temperature for the S/A powder preparation. The viscosity experiments show that the viscosity of the slurry will surge when the content of S/A powder reached 12 wt%, which impairs the uniformity of the gel abrasive tool. In the pre-grinding test, the abrasive tool with the S/A powder of 9 wt% shows great grinding stability, material removal rate (MRR) and wear resistance. The grinding experiments show that tool with S/A powder can achieve better surface quality and have a stable grinding process, and the glazing phenomena is ameliorated. After grinding, the average roughness R a of the sapphire substrate reaches 1.57 nm and its flatness reached 0.725 μm. After chemical mechanical polishing (CMP), the average R a of sapphire substrate reaches 0.64 nm and the scratch-free surface can be obtained.
engineering, mechanical, manufacturing