Abstract:Aspheric thin-walled crucibles with large diameters are widely used for photovoltaics and semiconductor industries, while they have hard-brittle and aspheric characteristics. Nevertheless, these crucibles strictly require atomic surfaces and high material removal rate (MRR). This is a challenge for chemical mechanical polishing (CMP). To break this challenge, a novel green CMP was developed for fused silica, containing ceria, lanthana, hydrogen peroxide, diethylene triaminepentaacetic acid pentasodium, carboxymethyl cellulose sodium and guanidine carbonate. After CMP, surface roughness Ra of 0.115 is obtained at a scanning area of 5 × 5 μm2 measured by atomic force microscopy, and MRR is 563 nm/min. In such an atomic surface, the MRR is the highest compared with those published previously. Transmission electron microscopy confirms that the thickness of damaged layer after CMP is only 2.63 nm. A novel approach of robot floating polishing is proposed for aspheric crucibles with a diameter of 810 mm and a height of 580 mm. Using the developed CMP, surface roughness Sa of 0.178 nm on inner surface of an aspheric thin-walled crucible is achieved under a measurement area of 50 × 50 μm2. X-ray photoelectron spectroscopy (XPS) and electron paramagnetic resonance reveal that the content of Ce3+ increased from 28.54 to 43.76 %. Through Raman, XPS and Fourier transform infrared spectroscopy, CMP mechanisms are elucidated. Densified damaged layer on the surface of fused silica was induced by the transformation of surface structure from six-membered to four- or three-membered network. Ce-OH and Si-OH were formed between fused silica and ceria abrasives, forming Ce-O-Si by condensation reaction of dehydration. The developed green CMP and approach provide new pathway to polish and manufacture atomic surfaces for aspheric thin-walled crucibles with large diameters.

A novel slurry for chemical mechanical polishing of single crystal diamond

Effect of slurry composition on the chemical mechanical polishing of thin diamond films

Smoothing of single crystal diamond by high-speed three-dimensional dynamic friction polishing: Optimization and surface bonds evolution mechanism

Polishing single-crystal silicon carbide with porous structure diamond and graphene-TiO2 slurries

A Systematic Study of the Factors Affecting the Surface Quality of Chemically Vapor-Deposited Diamond during Chemical and Mechanical Polishing

Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy

Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

Investigation on influence of polishing disc materials in UV-catalytic polishing of single crystal diamond

Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing

Approach: developing nano/sub-micron diamond slurry technology for enhanced precision polishing of optoelectronic materials

Angstrom surface with high material removal rate for quartz glass induced by silk dissolved novel green chemical mechanical polishing

Chemical mechanical polishing for sapphire wafers using a developed slurry

The Investigation of Graphene Oxide-Enhanced Hybrid Slurry Preparation and Its Polishing Characteristic on CVD Single Crystal Diamond

Roughness Control in the Processing of 2-Inch Polycrystalline Diamond Films on 4H-Sic Wafers

Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing

Achieving Ultralow Surface Roughness and High Material Removal Rate in Fused Silica Via a Novel Acid SiO2 Slurry and Its Chemical-Mechanical Polishing Mechanism

Novel green chemical mechanical polishing of fused silica through designing synergistic CeO 2 /h-BN abrasives with lubricity

Novel Eco-friendly Slurries for Chemical Mechanical Polishing of GCr15 Bearing Steel

A Novel Approach of Chemical Mechanical Polishing for a Titanium Alloy Using an Environment-Friendly Slurry

Atomic surface induced by novel green chemical mechanical polishing for aspheric thin-walled crucibles with large diameters

Nanomaterials and Equipment for Chemical-Mechanical Polishing of Single-Crystal Sapphire Wafers