Abstract:Abstract： In this article, one distributed circuit model for the on-chip single interconnect will be introduced at first, where all the lumped elements are frequency-independent and can be directly obtained from its geometrical and physical parameters. This ensures proper scalability of the model parameters because no optimization tuning or fitting for them is involved. Some popular and low-cost techniques, such as patterned ground shield (PGS) structures for suppressing the substrate loss of silicon substrate at high frequencies and differential signal transmission are also addressed here. Then, electromagnetic modeling of on-chip coupled (a)symmetrical interconnects will be performed, including all distributed parameters. The average power handling capability (APHC) of on-chip interconnects and even thin-film microstrip lines (TFML) are also addressed here. Finally, the electrothermal analysis of multilevel interconnects under electrostatic discharge (ESD) stress will be reported using the time-domain FEM.

A Two-Pole Circuit Model for VLSI High-Speed Interconnection

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

MCM Layout with Distributed-RLC Model

On High-Speed VLSI Interconnects: Analysis and Design

Modeling and Characterization of On‐Chip Interconnects

Modeling and Characterization of Carbon-Based Heterogeneous Interconnects for 3-D Ics

A New Model Library Approach to Extract VLSI Interconnect Capacitance

Transfer Functions of On-Chip Global Interconnects Based on Distributed RLCG Interconnects Model

Wideband lumped element model for on-chip (a)symmetrical coupled interconnects on lossy silicon substrate

Modeling of a Pair of Annular Through Silicon Vias (TSV)

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

A simplified synthesis of transmission lines with a tree structure

Scalable Model of On-Wafer Interconnects for High-Speed CMOS ICs

An RLC Interconnect Model Based on Fourier Analysis

High Order Distribute Circuit Model of Laminated Busbars and Its Order Reduction Techniques for Simulating Fast Turn-on and Turn-off Transients

Crosstalk Model and Estimation Formula for VLSI Interconnect Wires

Modeling and Simulation of High Speed VLSI Interconnects

Performance-Driven Interconnect Design Based on Distributed RC Delay Model

Analytical Interconnect Modeling Based on Equivalent Circuit Method

Full RLGC Model Extraction of Through Silicon Via (TSV) with Charge Distribution Effects