Abstract:Computer-Aided Design (CAD) tools are extensively used throughout all of the steps in a VLSI design flow. The physical design domain is one of the three domains that are conceptually abstracted in representing a VLSI design flow. This research work focuses on three areas in VLSI physical design domain: clock tree design and buffer insertion, interconnect model order reduction and LVS verification. First, an optimal buffer insertion for clock delay and skew minimization algorithm is developed based on the theory that the minimal clock delay can be obtained by equalizing derivatives of a convex function, and the minimal clock skew can be achieved by equalizing delay functions of different source-to-sink paths. Experimental results show that the presented algorithm achieves both minimal delay and skew in real clock tree design. Further, an automatic clock tree design algorithm is developed for realizing the pre-specified clock arrival time requirements that often occur in an IP block based design environment. In this proposed strategy, planar clock routing and buffer insertion are carried out simultaneously to minimize clock delay and skew, and a full waveform simulation is applied to ensure the signal integrity necessary for high-speed VLSI design. Second, an efficient balanced truncation realization algorithm is presented for interconnect model order reduction. This algorithm shows that there is no need to solve the whole Lyapunov equation for controllability and observability grammians before obtaining approximation to their predominant spaces, and a linear order reduction algorithm can be achieved by extending the O(n) Krylov Subspace Oblique Projection method. Finally, a unique LVS methodology is proposed for the verification of a quad-core microprocessor designed with a triple-well 90-nm CMOS technology. Due to the IP reuse, the standard LVS flow is incapable of handling the additional design complexity in verifying the LVS for the chip designed with multiple power domains. This proposed LVS strategy consists of two phases. The first phase involves verifying LVS at the block level as well as the full-chip level. The second phase aims at verifying the integrity of the multi-power-domain power grid. The proposed LVS methodology was successfully verified by real silicon.

On High-Speed VLSI Interconnects: Analysis and Design

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

Performance optimization of VLSI interconnect layout

Advanced RF/baseband Interconnect Schemes for Inter- and Intra-Ulsi Communications

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

A Two-Pole Circuit Model for VLSI High-Speed Interconnection

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Modeling and Characterization of On‐Chip Interconnects

Transfer Functions of On-Chip Global Interconnects Based on Distributed RLCG Interconnects Model

MCM Layout with Distributed-RLC Model

Performance-Driven Interconnect Design Based on Distributed RC Delay Model

Design and Verification of High-Speed VLSI Physical Design.

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Modeling and Simulation of High Speed VLSI Interconnects

Global Interconnect Design for High Speed ULSI and System-on-package

Scaling analysis of interconnectivity and crosstalk in VLSI circuits

Algorithms and Methodology in Physical Domain Optimization for High-Performance Vlsi Design

Noise Analysis and Transmission Coding Optimization for High-speed Interconnection

A simplified synthesis of transmission lines with a tree structure

A parasitic extraction method of VLSI interconnects for pre-route timing analysis

A Survey on Machine Learning-Based Routing for VLSI Physical Design