Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

WL Yuan,EP Li
DOI: https://doi.org/10.1109/isemc.2003.1236666
2003-01-01
Abstract:With the advancements in electronics, interests in interconnect and package in high-speed circuits are greatly increased. For precise timing among high-speed modules to synchronize signals and harmonize communication between modules, interconnect need be designed with high accuracy and are often meandered to equalize delay. The paper will present the investigations on the effects of different serpentine interconnect lines with various spacing, thickness and rise/fall edges on delay with a full-wave numerical technique, the finite-difference time-domain method. The insights and results acquired can be used to verify and optimize interconnect and timing designs for signal integrity purposes.
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