Abstract:Superconducting single flux quantum (SFQ) circuits can process information at extremely high speeds, in the range of hundreds of GHz. SFQ circuits are based on Josephson junction cells for switching logic and ballistic transmission for transferring SFQ pulses. Multi-chip modules (MCM) are often used to implement larger complex designs, which cannot be fit onto a single chip. We have optimized the design of wideband interconnects for transferring signals and SFQ pulses between chips in flip-chip MCMs and evaluated the importance of several design parameters such as the geometry of bump pads on chips, length of passive micro-strip lines (MSL)s, number of corners in MSLs as well as flux trapping and fabrication effects on the operating margins of the MCMs. Several test circuits have been designed to evaluate the above mentioned features and fabricated in the framework of 4.5-kA/cm2 HYPRES process. The MCMs bumps for electrical connections have been deposited using the waferlevel electroplating process. We have found that, at the optimized configuration, the maximum operating frequency of the MCM test circuit, a ring oscillator with chip-to-chip connections, approaches 100 GHz and is not noticeably affected by the presence of MCM interconnects, decreasing only about 3% with respect to the same circuit with no inter-chip connections.

Interconnection delay in high-speed multi chip modules

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

AN IMPROVED MODEL OF THE INTERCONNECTION DELAY OF MULTICHIP MODULES

Modeling and Characterization of On‐Chip Interconnects

Interconnection Delay in Very

Analysis of Signal Propagation on High‐speed Planar Interconnect Systems Based on Full‐wave and Macromodeling Techniques

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Time Delay Estimation and Data Analysis of Parallel Interconnect Lines in High Speed Circuits

On-chip Optical Interconnect for Reduced Delay Uncertainty

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

Design Analysis of CMOS Digital Integrated Circuit I/O Cell

Case Study of Interconnect Analysis for Standing Wave Oscillator Design

Analysis of Gate-Delay Models for High-Speed CMOS Circuits

Delay Analysis and Design Optimization for Low-Swing RC-Limited Global Interconnects

Research On Circuit-Level Design Of High Performance And Low Power Fpga Interconnect Circuits In 28nm Process

Design Challenges of Intrachiplet and Interchiplet Interconnection

Design and testing of high-speed interconnects for Superconducting multi-chip modules

Global Interconnect Design for High Speed ULSI and System-on-package

Fast Simulation of Interconnect-Dominant Circuits

System Level Interconnect Design for Network-on-chip Using Interconnect IPs.