Abstract:The multichip power module is an irreplaceable component for high-capacity converters. Dynamic current imbalance among parallel chips challenges the electro-thermal stability and limits the maximum current rating of the power module. In this paper, general mechanism models are proposed to reveal the layout-dominated dynamic current imbalance in multichip power module. The influence of the layout on the current sharing is comparatively evaluated by power modules with/without Kelvin connections. Focusing on the dynamic current imbalance, by a commercial multichip power module, finite element analysis and equivalent electric circuit are utilized to illustrate the impact of Kelvin connection. General mathematical and graphical models are created to address the current sharing of parallel chips affected by networked parasitic impedances. By the fabricated power module prototypes, experiments are presented concerning the current sharing, transient time, and switching loss. It is demonstrated the Kelvin connection can elevate switching speed and reduce switching loss of parallel chips, while its functionality to eliminate dynamic current imbalance depends on the parasitic impedances. Some design guidelines of multichip power module are presented for current sharing. To achieve satisfactory current sharing, advanced packaging layout by optimized chip arrangement and wire interconnection is further needed for the multichip power module.

AN IMPROVED MODEL OF THE INTERCONNECTION DELAY OF MULTICHIP MODULES

Interconnection delay in high-speed multi chip modules

Modeling and Characterization of On‐Chip Interconnects

A Multicore Chip Load Model for PDN Analysis Considering Voltage–Current-Timing Interdependency and Operation Mode Transitions

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

A Delay Model for Interconnect Trees Based on ABCD Matrix

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

Influence of Kelvin Connection on Current Dispatching in Multichip Power Module: Mechanism Modeling and Comparative Evaluation

Improved Delay Estimation Method for RLC Interconnects

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

A Delay Metric for VLSI Interconnect

New Metric for FPGA Interconnect Delays

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An iterative delay model for interconnects with coupling effects

Performance-Driven Interconnect Design Based on Distributed RC Delay Model

New Approaches To Interconnect Macromodeling With Explicit Delay Extraction

Path-based timing optimization by buffer insertion with accurate delay model

On Model Order Reduction of Interconnect Circuit Network: A Fast and Accurate Method

Design Challenges of Intrachiplet and Interchiplet Interconnection

Carbon Nanotube Based Delay Model For High Speed Energy Efficient on Chip Data Transmission Using: Current Mode Technique