OXIDATION BEHAVIOR OF FINE COPPER POWDER IN AIR BETWEEN 250-400 ℃

Guo Yanhui,Zhang Nan,Chen Jizhong
DOI: https://doi.org/10.3321/j.issn:0412-1961.2008.07.010
IF: 1.797
2008-01-01
ACTA METALLURGICA SINICA
Abstract:The changes of morphology and structure of fine copper powder during oxidization process were observed by SEM and TEM, and their weight gain processes were measured by thermal gravity analyser (TGA). Based on the experiments and some classical theories, the course of the oxidation of fine copper powder can be described as adsorption of oxygen atom -> formation of porous oxide film -> out diffusion of copper ion, thicking of oxide film, and a new kinetics equation was deduced to simulate the course. The analog results agree well with the data gained from the oxidation of copper between 250-400 degrees C.
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