Oxidation Kinetics of Nanoscale Copper Thin Films at Low Temperature Characterized by Sheet Resistance and Optical Transmittance

Cheng Zhong,YiMing Jiang,DaoMing Sun,Jia Gong,Bo Deng,Si Cao,Jin Lin
IF: 3.957
2009-01-01
Chinese Journal of Physics
Abstract:In an effort to overcome the limitations of traditional kinetics characterization methods used in thin films, two new methods were developed for the characterization of the oxidation kinetics of copper thin films in the nanometer range. Thin copper films with a smooth surface were prepared by vacuum evaporation and control of the evaporation rate. Atomic force microscopy (AFM) was employed to characterize the surface morphology of thin films. The oxidation kinetics of thin copper films (5 nm similar to 25 nm) were characterized by the change of sheet resistance and optical transmittance. The oxidation product, Cu(2)O, Was confirmed as the predominant oxide using X-ray diffraction (XRD). An accelerated oxidation behaviour was observed and the corresponding oxidation kinetics followed an inverse logarithmic rate law when the film was ultra thin, which was due to the presence of a strong electric field across the thin oxide. The results suggested that these two methods are effective for characterizing the oxidation kinetics of copper thin films.
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