Abstract:High-G accelerometers have a variety of applications with severe shock loadings especially in crash and impact environments. The package for a high-G accelerometer should provide both protection against such harsh environments and necessary communications with outside the package. The residual stress caused by packaging process which degrades the sensor performance should be considered at the beginning of packaging design. The accelerometer in this study is based on a piezoresistive structure fabricated by a standard MEMS fabrication process A glass cap was anodically bonded to the structure to protect the movable parts. Then a packaging substrate was fixed to above structures with an adhesive material. FEM simulation based on a simplified structure of the accelerometer has been applied in static analyses in order to find out the potential stress brought by the package. The affection of different adhesive and packaging materials on the acceletometer performance was simulated. The results of simulations show that both the Young's modulus of the adhesive and the coefficient of thermal expansion (CTE) of packaging substrate could have a significant impact on the initial output of the accelerometer. An experiment study on the affection was also conducted, and the results were similar to the results of FEM(finite element method) simulations for the simplified structure. Thus the FEM simulation of such simplified structure could serve as the basic of accelerometer packaging design. Based on former results, optimized process was suggested in the package of the accelerometer and the packaged accelerometer was tested with satisfactory results.

Study of Multi-ranged Piezoresistive Micro Accelerometer Package Failure under High Overload

Finite Element Simulation on Packaging of Hinged High-G Micromachined Accelerometer

The reliability of micro-accelerometer in harsh environment

Study on Package Thermal Stress of Multi-ranged Micro-accelerometer

Micro Accelerometer Reliability in Shock Environment

Study on Anti-Top Over-Loaded Technology of Multirange Micro-Accelerometer

Design And Simulation Of A Novel Piezoresistive Accelerometer For High Accuracy And Overload Ability

Design, fabrication and experiment of a MEMS piezoresistive high-g accelerometer

A high-g overload protected accelerometer with a novel microstructure

Study on the packaging technology for a high-G MEMS accelerometer

Design, Simulation and Fabrication of Triaxial MEMS High Shock Accelerometer

Design, Manufacture And Test Of Novel Mems Piezoresistive Accelerometer For High G Application

Influence of Package on Micro-Accelerometer Sensitivity

Investigation and experiment of high shock packaging technology for High-G MEMS accelerometer

Study on Dynamic Mechanical Behavior of MEMS Based on Free Hopkinson Pressure Bar

Over-range capacity of a piezoresistive microaccelerometer

Structural Failure Analysis and Numerical Simulation of Microaccelerometers under Impulsive Loading

A High Overloaded Piezoresistive Accelerometer Based on SOI Materials with Cantilever Beam

Finite Element Analysis of MEMS Package under High Impact

A Double-End Fixed Beam Structure of MEMS Piezoresistive High G Accelerometer

Three-Beam-Seismic-Mass Structure Piezoresistive Accelerometer for High Performance Crash Test