Finite Element Simulation on Packaging of Hinged High-G Micromachined Accelerometer

Zhiwei Xu
2007-01-01
Optics and Precision Engineering
Abstract:A novel packaged hinged high-g micromachined accelerometer was studied by finite element simulations.The mode shape of high-g accelerometer without packaging were analyzed,and then the first ten natural frequency characteristics of packaging structure without and with different potting materials were discussed.Experimental results conclude that the elastic modulus of potting material has a significant influence on the mode shape of the accelerometer packaged.The mode frequency of the packaging structure increases with the elastic modulus of potting material,but the small elastic modulus(E≤1 GPa) will bring a strong distortion of the accelerometer output.The simulation results also show that the potting material with enough large elastic modulus(E9 GPa) should be optimal selection for high-g accelerometer.
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