A silicon micromachined high-shock accelerometer with a bonded hinge structure

Kebin Fan,Lufeng Che,Bin Xiong,Yuelin Wang
DOI: https://doi.org/10.1088/0960-1317/17/6/015
2007-01-01
Journal of Micromechanics and Microengineering
Abstract:A silicon micromachined high- shock accelerometer with a bonded hinge structure is presented. The sensitivity of this accelerometer can be adjusted by changing the dimensions of the sensing beams, and the resonance frequency is mainly decided by the hinges. Based on simulation results of the finite element method, design parameters are obtained for a device with a resonance frequency of 573 kHz and large range of 200 000g. The shock accelerometer is fabricated by advanced silicon bulk micromachining technology, including deep- reactive ion etching and silicon - silicon bonding technology. The primary performance of the accelerometer is examined by a free dropping- bar system. The results of the shock tests show that the accelerometer has a sensitivity of 0.516 mu V g(-1) for a 44 614g shock acceleration under the 5 V excitation.
What problem does this paper attempt to address?