Effects of Incident Angle on Microstructure of Ni Thin Film Deposited by PVD

YingChun Shan,Xu Jiujun,Xiaodong He,He Fei,Li Mingwei

DOI: https://doi.org/10.3321/j.issn:1002-185x.2007.04.005

2007-01-01

Rare Metal Materials and Engineering

Abstract:A kinetic Monte Carlo (KMC) model was implemented to approach the relationship between the incident angle and the thin film microstructure for the Ni thin films prepared by physical vapor deposition (PVD). Two phenomena were incorporated in the KMC model: the adatom-surface collision and the adatom diffusion. In the KMC simulation, the Momentum Scheme was used to locate the initial location of adatom, and the activation energy was calculated by molecular statics (MS) calculations. To the simulation results, the surface roughness and packing density were applied to valuate the deposition configuration. The approaches indicate that an incident angle of 35* is the curve knee of surface roughness and packing density for the deposition rate of 5 mu m/min and the substrate temperatures of 300 K and 500 K; when the incident angle is less than 35*, the effects of incident angle on surface roughness and packing density are small; but when the incident angle is more than 35*, the surface roughness increases quickly and the packing density decreases sharply with increasing of incident angle. Furthermore, the effects of incident angle on the thin film microstructure are more severity when the substrate temperature is 300 K than 500 K. All these indicated that higher substrate temperatures will make adatom diffuse sufficiently and weaken the self-shadowing effect. In the case, the temperature is high enough and the deposition rate is suitable, a condensation structure also can not be gained if the incident angle is too large.