Effect of Substrate Temperature on Material Establishment in EB-PVD Technology

Shan Yingchun,He Xiaodong,Li Mingwei,Li Yao
DOI: https://doi.org/10.3969/j.issn.1007-2330.2006.01.009
2006-01-01
Abstract:Corresponding to the properties of Electron Beam-Physical Vapor Deposition,the effects of substrate temperature on material establishment are studied.First,basic diffusion models of thin film growth are established,then embedded atoms method is used to compute diffusion activation energies,and jumping probability is used as the weight criterion for expression of degrees of stability of surface atoms and for study of the effects of substrate temperature on diffusion of Ni on Ni surface.The approach is executed in two kinds of conditions:lower substrate temperature(250 to 450 K) and higher substrate temperature(750 to 1 000 K),and when studying the effects of substrate temperature on material establishment critical substrate temperature is found,Ni is 375 K.When substrate temperature below 375 K,there is no effect of temperature on jumping probability,however,when substrate above 375 K,the jumping probability shows exponential increase following the substrate temperature increasing.When substrate temperature is lower(Ni is 375 K),incidence atoms do not diffuse on surface,and material with many voids are easy to form,however,compact material is easy to be produced in higher substrate temperature.
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