Effects of incident angle on microstructure of Ni-Cr film deposited by PVD

Ying Chun Shan,Jiu Jun Xu,He E. Xiaodong,Ming Wei Li
DOI: https://doi.org/10.4028/www.scientific.net/KEM.373-374.184
2008-01-01
Key Engineering Materials
Abstract:A 2D kinetic Monte Carlo (KMC) simulation has been applied to study the microstructure of Ni-Cr film deposited by physical vapor deposition (PVD) for variable incident angle. In the KMC method, two phenomena were incorporated: adatom-surface collision and adatom diffusion, the interaction between atoms was described by embedded atom method and jumping energy was calculated by molecular statics calculations, initial location of adatom was located by Momentum Scheme. The results reveal that there exists critical incident angle, which is 35 degrees for Ni-Cr thin film. When incident angle is less than 35 degrees, incident angle have less affect on surface roughness factor and packing density, compact films with smooth surface are obtained, their surface roughness factor is bellow 1.12 and packing density is more than 99.6%. However, when incident angle is more than 35 degrees, surface roughness factor increases quickly and packing density decreases sharply with incident angle increasing: surface roughness factor increase to 1.5 and 2.3 for incident angle of 45 degrees and 60 degrees respectively, packing density is below 99% and 96% accordingly. Which reveal that the self-shadowing effect emphasizes with incident angle increasing when the incident angle is more than 35 degrees.
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