Abstract:A new approach is developed to extract depth‐resolved concentration profiles from single fixed‐angle X‐ray photoelectron spectra. By analyzing multiple core‐level peaks in the spectrum, an energy‐resolved measurement can be emulated without the need for a synchrotron. The method is demonstrated using native oxide layers on Ta, Pd, and Ti thin film samples. Many metals form nanometer‐thin self‐passivating oxide layers upon exposure to the atmosphere, which affects a wide range of interfacial properties and shapes the way how metals interact with their environment. Such native oxide layers are commonly analyzed by X‐ray photoelectron spectroscopy (XPS), which provides a depth‐resolved chemical state and compositional analysis either by ion etching or modeling of the electron escape depths. The latter is commonly used to calculate the average thickness of a native oxide layer. However, the measurement of concentration profiles at the oxide‐metal interface remains challenging. Here, a simple and accessible approach for the depth profiling of ultrathin oxide layers within single fixed‐angle XPS spectra is proposed. Instead of using only one peak in the spectrum, as is usually the case, all peaks within the energy range of a standard lab device are utilized, thus resembling energy‐resolved XPS without the need for a synchrotron. New models that allow the calculation of depth‐resolved concentration profiles at the oxide‐metal interface are derived and tested, which are also valid for angular‐ and energy‐resolved XPS. The proposed method not only improves the accuracy of earlier approaches but also paves the way for a more holistic understanding of the XPS spectrum.

Depth Profiling of Thin Films with Pulsed Glow Discharge Atomic Emission Spectrometry

Feasibility of applying microsecond-pulse glow discharge time of flight mass spectrometry in surface depth analysis

Depth Profiling of Nanometer Coatings by Low Temperature Plasma Probe Combined with Inductively Coupled Plasma Mass Spectrometry.

Feasibility of applying microsecond-pulse glow discharge time of flight mass spectrometry in surface depth analysis1This paper was published on the Special Issue from the BCEIA Conference in Shanhhai, China, October 1997.1

Surface Profile Measurement of Micro-Optics by Using a Long Stroke Atomic Force Microscope

Towards High Accuracy Surface Profile Characterization in Atomic Force Microscopy

Depth Profiling of Metal Coating Circuit Board by Low Temperature Plasma-Inductively Coupled Plasma-Mass Spectroscopy System

Depth profiling of tungsten coating layer on CuCrZr alloy using LIBS approach

Depth resolution optimized sputter depth profiling of a polycrystalline Al layer

Angle-Resolved Laser-Induced Breakdown Spectrometry for Depth Profiling of Coated Materials

XPS on corrosion products of ZnCr coated steel: on the reliability of Ar+ ion depth profiling for multi component material analysis

Femtosecond laser ablation (fs-LA) XPS – A novel XPS depth profiling technique for thin films, coatings and multi-layered structures

Note: Measurement of the Cathode Layer Thickness in Glow Discharges with a Langmuir Probe

Direct structure depth profiling of polycrystalline thin films by X-ray diffraction and its application

Precise Strain Profile Measurement As a Function of Depth in Thermal Barrier Coatings Using High Energy Synchrotron X-rays

Auger Depth Profile Studies of Diffusion at Iron Phthalocyanine/Copper Phthalocyanine Interfaces

Diagnostics of the Thickness of a Plasma Electrolytic Oxidation Coating on a Nanostructured Mg-Sr Alloy

Sub‐Nanometer Depth Profiling of Native Metal Oxide Layers Within Single Fixed‐Angle X‐Ray Photoelectron Spectra

Measurement of Nanoscale Film Thickness Using Neutron Depth Profiling Technique

Dimple Grinding Coupled with Optical Microscopy for Porosity Analysis of Metallic Coatings

Reverse depth profiling of electrodeposited Co/Cu multilayers by SNMS