Depth Profiling of Metal Coating Circuit Board by Low Temperature Plasma-Inductively Coupled Plasma-Mass Spectroscopy System

Yang Meng,Li Ming,Xue Jiao,Zhao Xin,Huang Xiu,Feng Lu,Xing Zhi
DOI: https://doi.org/10.11895/j.issn.0253-3820.150070
IF: 1.193
2015-01-01
Chinese Journal of Analytical Chemistry
Abstract:A depth profile analysis method for Au, Ni and Cu in the metal coating circuit board by low temperature plasma (LTP) coupled with inductively coupled plasma. mass spectroscopy (ICP-MS) system was established. The LTP probe which was generated by dielectric barrier discharge (DBD) ablated the sample layer by layer for the determination by ICP. MS. The experimental conditions such as DBD applied electric power, discharge gas flow rate and sputtering depth were optimized. Depth profiling of a coating circuit board (20 mu m Au/10 mu m Ni/Cu substrate) could be completed by LTP-ICPMS within 30 s. The detection results were consistent with X-ray photoelectron spectroscopy (XPS), which showed that the technology could be directly used to analyze solid samples of the longitudinal depth profile of elements.
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