Photoablative Etching of Polymers for Integrated Optoelectronic Devices

P LEMOINE,JD MAGAN,W BLAU
DOI: https://doi.org/10.1016/0167-9317(91)90130-6
IF: 2.3
1991-01-01
Microelectronic Engineering
Abstract:Laser photoablation of a variety of organic polymer films was observed at wavelengths of 193nm, 248nm and 532nm. Polydiacetylenes showed a very high intensity dependence of the etch rate. No degradation was observed in the remaining layers of the film except for visible (532nm) irradiation. Polystyrene films showed a high sensitivity of the ablation characteristics on dye doping. For the example of a polycarbonate film we fitted the ablation data to a model adapted from Magan et al. [1].
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