Abstract:The energy density of chip is becoming increasingly higher with the power electronic devices developing toward miniaturization, high power and integration, which will lead a higher operating temperature. However, the traditional Sn-based soldering process fails to meet the elevated temperature. Transient liquid phase (TLP) soldering, which can form high-melting-point joints at relatively low temperatures, has been proven to be a promising bonding method for solving this technological challenge. Nevertheless, a common drawback for TLP soldering is that it will consume a very long time for the complete formation of intermetallic joints, up to tens of minutes, which will lead extra thermal stress and seriously negative effects on the reliability of packaging systems. Recently, this technological puzzle has been proven to be solved by a novel ultrasonic-assisted TLP soldering process, in which the ultrarapid formation of complete intermetallic joints was achieved due to the accelerated diffusion of Cu from the substrates into the molten Sn interlayer under the complex sonochemical effects of acoustic field on the interfacial reaction. In this study, the microstructure and mechanical properties of complete Cu-Sn intermetallic joints ultrarapidly formed by ultrasonic-assisted TLP soldering process were investigated. The sandwich Cu/Sn/Cu system was placed on the heating platform, and then the ultrasonic vibrations and the bonding force were applied on it. The horizontal ultrasonic frequency, pressure, power, bonding temperature and time were fixed as 20 kHz, 0.5 MPa, 300 W, 250 degrees C and 5 s. In summary, the complete intermetallic joints composed of Cu6Sn5 interlayer with a thickness about 15 pm and Cu3Sn boundary layers with a thickness about 1 pm were ultrarapidly formed by ultrasonic-assisted TLP soldering process. The formed Cu6Sn5 grains were remarkably refined to be with an average grain size less than 5 pm. Compared with the intermatllic joints formed by traditional TLP soldering process, the resulted intermetallic joints performed more uniform mechanical properties with elastic modulus and hardness of about 123 GPa and 6.0 GPa respectively, as well as a higher reliability with a shear strength of 60 MPa.

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Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging

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Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

Interfacial Reaction and Mechanical Properties for Cu/Sn/Ag System Low Temperature Transient Liquid Phase Bonding

Bonding of copper to silicon chips using vapor-deposited tin film

Rapid Formation of Cu/Cu3Sn/Cu Joints Using Ultrasonic Bonding Process at Ambient Temperature

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

Fine-Pitch Cu-Sn Transient-Liquid-Phase Bonding Based on Reflow and Pre-Bonding

Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding

Low-Temperature and CMP-Free Direct Bonding of Porous Cu Bumps

Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding

Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps with a 4-Μm Fine Pitch

Transient Liquid Phase Bonding of Cu@Sn Core–shell Particles with Added Sn–3.0Cu–0.5Ag

Effect of Powders on Microstructures and Mechanical Properties for Sn–Ag Transient Liquid Phase Bonding in Air

Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications

Microstructures and Mechanical Properties of Cu/Sn/Cu Structure Ultrasonic-TLP Joint

Solderless Bonding with Nanoporous Copper As Interlayer for High-Temperature Applications.

Microstructure Characterization and Mechanical Behavior for Ag3sn Joint Produced by Foil-Based Tlp Bonding in Air Atmosphere

Low Temperature Bonding of Metals by Deposition of Nanoparticles at the Interface