A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

Jeng-Hau Huang,Po-Shao Shih,Vengudusamy Renganathan,Simon Johannes Gräfner,Yu-Chun Lin,Chin-Li Kao,Yung-Sheng Lin,Yun-Ching Hung,Chengheng Robert Kao

DOI: https://doi.org/10.3390/ma17071638

IF: 3.4

2024-04-04

Materials

Abstract:This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper–quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

The paper aims to address the new challenges brought by the miniaturization of high-density and 3D stacked interconnections in chip packaging applications in the semiconductor industry. Specifically, the study proposes a new bonding method to achieve efficient copper pillar interconnections under low-temperature and low-pressure conditions. Current technologies such as hybrid bonding interconnections, solid-liquid interface diffusion, and anisotropic conductive films generally have issues with high pressure and high temperature, which may adversely affect surrounding precision components. Additionally, while microfluidic electroless deposition (MELI) is a potential solution, its complexity and time-consuming nature make it unsuitable for large-scale production.

To overcome these challenges, this paper develops an improved plating solution formula that simplifies the process by increasing copper concentration and plating rate, eliminating the need for fluid movement, and thus shortening processing time. The study employs the Taguchi method to optimize the copper-tetrol composite solution formula, achieving a copper concentration more than 5 times that of traditional solutions and a plating rate of 22.2 µm/h, with a decomposition time of 8 minutes on the copper layer substrate. This method successfully completes copper pillar bonding within 7 minutes at 35°C and achieves a bonding rate of up to 99% through surface planarization. Mechanical shear tests indicate that the technique has significant fracture strength, reaching 76 MPa. Therefore, this study provides a low-temperature, pressure-free, efficient, and simple copper pillar bonding technology suitable for industrial production.