Abstract:With the advancement of semiconductor manufacturing technology, thin film structures were widely used in MEMS devices. These films played critical roles in providing support, reinforcement, and insulation in MEMS devices. However, due to their microscopic dimensions, the sensitivity of their parameters and performance to thermal stress increased significantly. In this study, a Pirani gauge sample with a multilayer thin film structure was designed and fabricated. Based on this sample, finite element modeling analysis and thermal stress experiments were conducted. The finite element modeling analysis employed a combination of steady-state and transient methods to simulate the deformation and stress distribution of the device at room temperature (25 °C), low temperature (−55 °C), and high temperature (125 °C). The thermal stress test involved placing the sample in a temperature cycling chamber for temperature cycling tests. After the tests, the resonant frequency and surface deformation of the device were measured to quantitatively evaluate the impact of thermal stress on the deformation and resonant frequency parameters of the device. After the experiments, it was found that the clamped-end beams made of Pt were a stress concentration area. Additionally, the repetitive thermal load caused the cantilever beam to move cyclically in the Z direction. This movement altered the deformation of the film and the resonant frequency. The suspended film exhibited concavity, and the overall trend of the resonant frequency was downward. Over time, this could even lead to the fracture of the clamped-end beams. The variation of mechanical parameters derived from finite element simulations and experiments provided an important reference value for device design improvement and played a crucial role in enhancing the reliability of thin film devices.

Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials

Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS

Design, Fabrication And Measurement Of Tan Thin Film Resistor Based On Mems Technology

Analysis, simulation and fabrication of MEMS springs for a micro-tensile system

A New Type of MEMS Accelerometer with Up-Tuning Structure

A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique

An integrated push-to-pull micromechanical device: Design, fabrication, and in-situ experiment

Technique and Structure for Testing Bonding Intension in Micron Scale

DETERMINATION OF MECHANICAL BEHAVIOR OF MEMS MATERIALS

OS5-2-3 an In-Situ Micro-Tension Setup and Its Application

Improvement Of Thin Film Tensile Testing Technology Using Process Integrated Specimen And Considering Its Out-Of-Plane Deformation

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Micro-mechanical Characterisation for MEMS Thin Films by Bending Μ-Machined Cantilevers

Variation of MEMS Thin Film Device Parameters under the Influence of Thermal Stresses

Testing And Design Of Nano Electromechanical Structure

In Situ and Real-Time Tensile Testing of Thin Films Using Double-Field-of-view Electronic Speckle Pattern Interferometry

Process nano scale mechanical properties measurement of thin metal films using a novel paddle cantilever test structure

MEMS based nanomechanical testing method with independent electronic sensing of stress and strain

Mems/Nems Mechanical Characterization on Different Thin - Film Materials by Scanning along Micro-Machined Cantilevers

On Line Measurement of Maximal Torsional Strength of Micro Level Structure

Design and Manufacture of a High Precision MEMS Flexible Force Sensor