Electrochemically driven rapid wetting of 3YSZ by 60Cu–40Ag and its robust joining to 304 stainless steel

Lin Li,Can Wei,Ping Shen
DOI: https://doi.org/10.1016/j.jeurceramsoc.2020.04.039
IF: 5.7
2020-09-01
Journal of the European Ceramic Society
Abstract:<p>We designed a soft Cu-based brazing filler (60Cu―40Ag in wt.%) and investigated its wettability and brazeability with 3 mol% yttria-stabilized zirconia (3YSZ) under direct current (DC) application. Increasing the current intensity dramatically accelerated the spreading rate and decreased the final contact angle. When the DC reached 60 mA, the contact angle decreased from 140° to 50° within 50 s and finally stabilized at 26° in approximately 300 s. The change in the stoichiometry of the 3YSZ substrate and the adsorption of Zr at the triple line were presumably responsible for the electrochemically induced wetting improvement. Furthermore, robust joining of 3YSZ to 304 stainless steel (304 SS) with a shear strength of 215 ± 9 MPa was achieved in only 300 s by applying a DC of 30 mA using this 60Cu―40Ag filler. The AgCu<sub>4</sub>Zr formed at the 60Cu―40Ag/3YSZ interface was critical for the robust joining. This work provides a novel route for obtaining robust zirconia―metal joints.</p>
materials science, ceramics
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