Enhanced thermoelectricity at the ultra-thin film limit

Thao T. T. Nguyen,Linh T. Dang,Giang H. Bach,Tung H. Dang,Kien T. Nguyen,Hong T. Pham,Thuat T. Nguyen,Tuyen V. Nguyen,Toan T. Nguyen,Hung Q. Nguyen
DOI: https://doi.org/10.1063/5.0010274
2019-12-24
Abstract:At the ultra-thin film limit, quantum confinement strongly improves thermoelectric figure of merit in materials such as Sb$_2$Te$_3$ and Bi$_2$Te$_3$. These high quality films have only been realized using well controlled techniques such as molecular beam epitaxy. We report a two fold increase in the Seebeck coefficient for both p-type Sb$_2$Te$_3$ and n-type Bi$_2$Te$_3$ using thermal co-evaporation, an affordable approach. At the thick film limit greater than 100 nm, their Seebeck coefficients are around 100 $\mu V/K$, similar to results obtained in other work. When the films are thinner than 50 nm, the Seebeck coefficient increases to about 500 $\mu V/K$. With a total Seebeck coefficient $\sim$ 1 mV/K and an estimate ZT $\sim$ 2, this pair of materials is the first step to a practical micro-cooler at room temperature.
Materials Science
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