Oxidation of silicon nanowires for top-gated field effect transistors

Bangzhi Liu,Yanfeng Wang,T. Ho,K. Lew,S. Eichfeld,J. Redwing,T. Mayer,S. Mohney
DOI: https://doi.org/10.1116/1.2899333
2008-03-26
Abstract:The oxidation of unintentionally doped p-type silicon nanowires grown by the vapor-liquid-solid (VLS) method and their integration into top-gated field effect transistors is reported. Dry thermal oxidation of as-grown silicon nanowires with diameters ranging from 20to400nm was carried out at 700 and 900°C with or without the addition of a chlorinated gas source. The oxidation rate was strongly dependent on the as-grown nanowire diameter, with the large-diameter nanowires oxidizing up to five times faster than the smallest nanowires at 900°C. At each diameter, the addition of trichloroethane (TCA) enhanced the rate compared to oxidation in pure O2. Top-gated field effect transistors fabricated from nanowires oxidized at 700°C had significantly less hysteresis in their subthreshold properties when TCA was added, but oxidation at 900°C with or without TCA provided hysteresis-free devices with improved subthreshold slope. Such enhancements in the electrical properties are expected based on advances in planar ...
Materials Science
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