Study on Thermal Oxidation of Si Nanowires

JL Liu,Y Lu,Y Shi,SL Gu,RL Jiang,F Wang,HM Bu,YD Zheng
DOI: https://doi.org/10.1002/(sici)1521-396x(199808)168:2<441::aid-pssa441>3.0.co;2-v
1998-01-01
Abstract:In this paper we reported the results on the low-temperature thermal oxidation of Si nanowires. Various polygon-shaped Si nanowires with linewidths between 100 and 300 nm were fabricated on Si/Si1-xGex/Si heterostructure substrates by using lithography, reactive ion etching, and subsequent selective chemical etching. We find that oxidized Si nanowires following 750 and 775 degrees C wet oxidation will keep the same shape as the initial unoxidized samples, and all the SiO2 boundaries of oxidized samples will arrive at a circular shape. These results, which should be due to stress effects, provide useful information for understanding the behavior of non-planar oxidation that is used in modern Si nanoelectronic technology.
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