Abstract:As an important basic material of electronic equipment, copper (Cu) foils should have a small thickness, good mechanical properties, and excellent thermal conductivity. However, preparing an ultrathin Cu foil with good properties remains challenging. Herein, we report an electroless deposition (ELD) strategy for the facile and scalable preparation of an ultrathin freestanding nickel-coated graphene (NCG)/Cu composite foil in a short time of 25 min. The NCG can significantly improve the mechanical and physical properties of composite foils. Experimental results reveal that the NCG/Cu composite foil manifests the best performance when the NCG concentration in an ELD bath was 30 mg/L. The composite foil evidenced a thickness of 1.1 μm, a high tensile strength of 338.7 MPa, and a high thermal conductivity of 431.2 W/mK. Compared with the pure Cu foil, both bending times and elastic modulus are increased by 298.1 and 737.3%, respectively. Remarkably, the composite foil has excellent heat dissipation performance, showing enormous potential as a heat sink material. This work proposes a new method for manufacturing the ultrathin graphene-reinforced Cu composite foil with high performance for numerous applications.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.1c01519?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.1c01519</a>.Microstructural characterization of GO; relationship between the bulk viscosity of the chitosan solution and standing times; elemental composition of the mapping area in <a class="internalNav" href="#fig3">Figure </a><a class="internalNav" href="#fig3">3</a>f; digital image of the flexible polyimide film and the prepared NCG/Cu composite foil; photographs of the ELD baths with different concentrations of NCG; Cu particle diameter histograms of composite foils that were produced with different concentrations of NCG; morphology and the TEM image of the composite foil prepared by adding rGO without Ni modification; characterization of the composite foil with different thickness after reacting for different times; Raman analysis of NCG and the composite foil; electrical resistivity of the composite foil with various concentrations of NCG; folding endurance of composite foils with various concentrations of NCG at different temperatures; analysis curves of the hardness and modulus of the composite foil with different concentrations of NCG; mechanical properties of the commercial electrodeposited Cu foil; specific parameters of the thermal conductive properties for the pure Cu foil and NCG/Cu foils; cross-sectional SEM image of foils for testing the heat dissipation performance (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01519/suppl_file/am1c01519_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

Preparation of Ultra-thin Copper Foil with Low Profile and High Tensile Strength on Surface of 18-μm Carrier Copper Foil

Preparation of Ultra-thin sandwich Cu-Cu/CNTs-Cu Composite Foil with High Tensile Strength by Electrodeposition

High Strength and High Ductility Copper Obtained by Topologically Controlled Planar Heterogeneous Structures

High-strength copper foil prepared with 2-mercaptothiazoline by direct current electrodeposition

Mechanical Properties and Microstructure of Rolled and Electrodeposited Thin Copper Foil

Processing and Specimen Thickness to Grain Size (t/d) Ratio Effects on Tensile Behaviour and Microformability of Copper Foils

Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives

Single-crystallization of electrolytic copper foils

Purification of Copper Foils Driven by Single Crystallization

Functional additives inhibit crystal growth to achieve low-roughness and high-peel strength of micro-coarsening copper foil

Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil

Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil

Scalable Preparation of Ultrathin Graphene-Reinforced Copper Composite Foils with High Mechanical Properties and Excellent Heat Dissipation

Softened Microstructure and Properties of 12 μm Thick Rolled Copper Foil

Ultrasonic-assisted preparation-forming-curing process for ultra-thin micro-fiber metal laminates: Deformation characteristics

Ultra-high flatness and conductivity of copper electrodeposits obtained by nano-twinned/fine-grained double layer electrodeposition

Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

Effect of dislocation and residual stress on etching performance of 12 μm thick rolled copper foil during pre-stretching

Preparation and anti-frosting performance of super-hydrophobic surface based on copper foil

Rice-inspired oriented copper fiber wick with excellent capillary performance for ultra-thin vapor chamber