Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil

Linping Yu,Long Chen,Qizhi Chen,Luli Feng,Ziyi Xu,Bo Nan,Xiyue Kang,Yuehui He
DOI: https://doi.org/10.1016/j.jiec.2021.07.025
IF: 6.76
2021-11-01
Journal of Industrial and Engineering Chemistry
Abstract:An ultrathin Ni-Cu alloy foil was prepared by electrodeposition-vacuum sintering method.The uniform composition can be achieved through mutual diffusion of atoms.The Kirkendall pores can be avoided by controlling the sintering temperature.The Ni-Cu alloy foil shows superior corrosion resistance compared with Cu foil.Cost-effective ultrathin alloy foils (< 20 μm) are highly expected with the development of electronic industry and micro-system technology. In this paper, electrodeposition combined with vacuum sintering is used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (± 0.2) μm. For the ultrathin Ni-Cu alloy foil, a densified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 hours. Under the current density of 10 mA‧cm-2, 700 s is the optimal electrodeposition time to obtain the highest tensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensile strength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cu alloy foil, which may provide an inspiration for future development of integrated electronic or medical devices.Download : Download high-res image (78KB)Download : Download full-size image
engineering, chemical,chemistry, multidisciplinary
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