Abstract:The production of large single-crystal metal foils with various facet indices has long been a pursuit in materials science owing to their potential applications in crystal epitaxy, catalysis, electronics and thermal engineering<a href="#ref-CR1">1</a>,<a href="#ref-CR2">2</a>,<a href="#ref-CR3">3</a>,<a href="#ref-CR4">4</a>,<a href="/articles/s41586-020-2298-5#ref-CR5">5</a>. For a given metal, there are only three sets of low-index facets ({100}, {110} and {111}). In comparison, high-index facets are in principle infinite and could afford richer surface structures and properties. However, the controlled preparation of single-crystal foils with high-index facets is challenging, because they are neither thermodynamically<a href="/articles/s41586-020-2298-5#ref-CR6">6</a>,<a href="/articles/s41586-020-2298-5#ref-CR7">7</a> nor kinetically<a href="/articles/s41586-020-2298-5#ref-CR3">3</a> favourable compared to low-index facets<a href="#ref-CR6">6</a>,<a href="#ref-CR7">7</a>,<a href="#ref-CR8">8</a>,<a href="#ref-CR9">9</a>,<a href="#ref-CR10">10</a>,<a href="#ref-CR11">11</a>,<a href="#ref-CR12">12</a>,<a href="#ref-CR13">13</a>,<a href="#ref-CR14">14</a>,<a href="#ref-CR15">15</a>,<a href="#ref-CR16">16</a>,<a href="#ref-CR17">17</a>,<a href="/articles/s41586-020-2298-5#ref-CR18">18</a>. Here we report a seeded growth technique for building a library of single-crystal copper foils with sizes of about 30 × 20 square centimetres and more than 30 kinds of facet. A mild pre-oxidation of polycrystalline copper foils, followed by annealing in a reducing atmosphere, leads to the growth of high-index copper facets that cover almost the entire foil and have the potential of growing to lengths of several metres. The creation of oxide surface layers on our foils means that surface energy minimization is not a key determinant of facet selection for growth, as is usually the case. Instead, facet selection is dictated randomly by the facet of the largest grain (irrespective of its surface energy), which consumes smaller grains and eliminates grain boundaries. Our high-index foils can be used as seeds for the growth of other Cu foils along either the in-plane or the out-of-plane direction. We show that this technique is also applicable to the growth of high-index single-crystal nickel foils, and we explore the possibility of using our high-index copper foils as substrates for the epitaxial growth of two-dimensional materials. Other applications are expected in selective catalysis, low-impedance electrical conduction and heat dissipation.

Single-crystallization of electrolytic copper foils

Purification of Copper Foils Driven by Single Crystallization

Production of Single-Crystal Cu Plates by Electrodeposition on High-Index Cu Foils.

Seeded growth of large single-crystal copper foils with high-index facets

Mechanical Properties and Microstructure of Rolled and Electrodeposited Thin Copper Foil

Fast Single-Crystallization of Cu Foils Facilitated by Graphene Growth

Electroless Deposition of Automatically Shedded Thin Copper Foils

Preparation of Nano Twin Copper Foil with High Elongation and Excellent Suppression Self-Annealing Via Pulse Superposition Direct Current Method

Large Single‐Crystal Cu Foils with High‐Index Facets by Strain‐Engineered Anomalous Grain Growth

Single-Crystal Cu(111) Foil Preparation by Direct Bonding Technology

Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates

Fast growth of centimeter-scale single-crystal copper foils with high-index planes by the edge-incision effect

Study on the relationship between crystal plane orientation and strength of electrolytic copper foil

Ultra-high flatness and conductivity of copper electrodeposits obtained by nano-twinned/fine-grained double layer electrodeposition

Surface Monocrystallization of Copper Foil for Fast Growth of Large Single‐Crystal Graphene under Free Molecular Flow

Research Progress on the Texture of Electrolytic Copper Foils

Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper

Oxidization‐Temperature‐Triggered Rapid Preparation of Large‐Area Single‐Crystal Cu(111) Foil

Preparation of Ultra-thin Copper Foil with Low Profile and High Tensile Strength on Surface of 18-μm Carrier Copper Foil

A novel strategy to electrodeposit high-quality copper foils using composite additive and pulse superimposed on direct current