Production of Single-Crystal Cu Plates by Electrodeposition on High-Index Cu Foils.

Xingguang Li,Zhihong Zhang,Zhibin Zhang,Jinzong Kou,Muhong Wu,Mengze Zhao,Ruixi Qiao,Zhiqiang Ding,Zhiqiang Zhang,Fang Liu,Xiaonan Yang,Dingxin Zou,Xinqiang Wang,Peng Gao,Ying Fu,Enge Wang,Kaihui Liu
DOI: https://doi.org/10.1016/j.scib.2023.06.023
IF: 18.9
2023-01-01
Science Bulletin
Abstract:Massive production of single-crystal metals has been a long pursuit in materials science and engineering due to their superior electrical,thermal and mechanical performances compared with polycrystalline ones.Single-crystal metal ingots could be tradition-ally fabricated by the Czochralski technique,and large-size single-crystal metal foils(with thickness limited to several tens of micro-meters)have been recently prepared by the designed thermal annealing of polycrystalline ones[1-4].
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