Abstract:Harsh operating conditions require a system capable of uncompromising performance in extreme environments. Molecular decomposition metals and additive manufacturing enable high throughput and rapid prototyping of stoichiometry and composition‐controlled copper‐based materials. The resulting Copper─Nickel hybrid is electrically stable for 25 h at 1000 °C, thus paving a way for printed antenna and sensor electronics that can reliably operate in extreme environments. As the modern electronic technology extends into operating in harsh working conditions, it calls for a system that is capable of uncompromising performance in extreme environments, thus providing a strong motivation to look for advanced materials and electronics with the capability of high‐throughput and rapid prototyping. Coupled with additive manufacturing, molecular decomposition metals bypass the challenging oddities of traditional material‐limited and thermally initiated metalworking, enabling high throughput and rapid prototyping of stoichiometry and composition‐controlled metals. Here, a new paradigm for the design and additive manufacturing of copper metallic alloy materials onto ceramics is described by printing molecular decomposable metal materials, capable of withstanding thermo‐mechanical loading, operating in extreme environments in static and dynamic conditions. The resulting printed hybrid electronics are electrically stable for 25 h of aging at 1000 °C. This curious fact paves a way for printed antenna and sensor electronics that reliably operate up to 1000 °C. These results can be further extended to establish other printable molecular decomposable materials as a platform for rapid prototyping of high temperature electronics that are suitable for harsh environments.

Copper Nanoplates for Printing Flexible High-Temperature Conductors

High‐Temperature Oxidation‐Resistant Printed Copper Conductors

Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics

Printable Copper Sensor Electronics for High Temperature

High‐Temperature Copper–Graphene Conductors via Aerosol Jetting

High‐Temperature Hybridized Copper‐Boron Nitride Materials from Additive Manufacturing

All-Printed Conformal High-Temperature Electronics on Flexible Ceramics

Antioxidant high-conductivity copper paste for low-cost flexible printed electronics

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

A low-cure-temperature copper nano ink for highly conductive printed electrodes

Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling

Site-selective Fabrication of Patterned Transparent Copper Mesh on Flexible Substrates at Mild Temperature for Green, Low Cost Electronics

Highly Electrically Conductive and Stretchable Copper Nanowires-Based Composite for Flexible and Printable Electronics

High Current Carrying and Thermal Conductive Copper-Carbon Conductors

Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics

Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics

Anti-oxidative Copper Nanoparticle Paste for Cu–Cu Bonding at Low Temperature in Air

Antioxidative Effect of Lactic Acid-Stabilized Copper Nanoparticles Prepared in Aqueous Solution

Passivation coating on electrospun copper nanofibers for stable transparent electrodes.

Preparation of Antioxidative Nano Copper Pastes for Printed Electronics Application

Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature.