All-Printed Conformal High-Temperature Electronics on Flexible Ceramics

Zheng Li,Scott Scheers,Lu An,Aditya Chivate,Saurabh Khuje,Kevin Xu,Yong Hu,Yulong Huang,Shuquan Chang,Kathy Olenick,John Olenick,Jun Hwan Choi,Chi Zhou,Shenqiang Ren
DOI: https://doi.org/10.1021/acsaelm.9b00798
IF: 4.494
2020-01-01
ACS Applied Electronic Materials
Abstract:Each year, Cu is used in more than 60% of electrical applications due to its excellent electrical, thermal, and mechanical properties. Here, we report all-printed flexible conformal electronics consisting of Cu nanowire features (>10(6) S/m) and dielectric substrates. High aspect ratio Cu nanowires enable a conductive percolation network after printing to produce a conductive trace onto a variety of artificial substrates. The electrical conductivity of printed Cu nanowires can be controlled by aqueous-based reaction and printing conditions, while the stability of printed features is shown by Cu/Ni alloying to effectively protect it from oxidation. We demonstrate a reflection coefficient of -60 dB at the resonant frequency of 2.5 GHz using flexible radio-frequency antenna by printing Cu nanowires on flexible ceramics. Such flexible antenna electronics also exhibit high sensitivity (0.05% degrees C-1) and accuracy (15 degrees C) for real-time high-temperature sensing. The findings shown here suggest the potential of high-temperature hybrid conformal electronics using all-printed Cu ink and flexible ceramic materials.
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