Abstract:Harsh operating conditions require a system capable of uncompromising performance in extreme environments. Molecular decomposition metals and additive manufacturing enable high throughput and rapid prototyping of stoichiometry and composition‐controlled copper‐based materials. The resulting Copper─Nickel hybrid is electrically stable for 25 h at 1000 °C, thus paving a way for printed antenna and sensor electronics that can reliably operate in extreme environments. As the modern electronic technology extends into operating in harsh working conditions, it calls for a system that is capable of uncompromising performance in extreme environments, thus providing a strong motivation to look for advanced materials and electronics with the capability of high‐throughput and rapid prototyping. Coupled with additive manufacturing, molecular decomposition metals bypass the challenging oddities of traditional material‐limited and thermally initiated metalworking, enabling high throughput and rapid prototyping of stoichiometry and composition‐controlled metals. Here, a new paradigm for the design and additive manufacturing of copper metallic alloy materials onto ceramics is described by printing molecular decomposable metal materials, capable of withstanding thermo‐mechanical loading, operating in extreme environments in static and dynamic conditions. The resulting printed hybrid electronics are electrically stable for 25 h of aging at 1000 °C. This curious fact paves a way for printed antenna and sensor electronics that reliably operate up to 1000 °C. These results can be further extended to establish other printable molecular decomposable materials as a platform for rapid prototyping of high temperature electronics that are suitable for harsh environments.

Printable Copper Sensor Electronics for High Temperature

Copper Nanoplates for Printing Flexible High-Temperature Conductors

Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics

All-Printed Conformal High-Temperature Electronics on Flexible Ceramics

High‐Temperature Oxidation‐Resistant Printed Copper Conductors

High‐Temperature Copper–Graphene Conductors via Aerosol Jetting

A low-cure-temperature copper nano ink for highly conductive printed electrodes

Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials

Printed Structural Temperature Monitoring Embedded in Multi-Process Hybrid Additive Manufacturing

A New Copper Ink With Low Sintering Temperature For Flexible Substrates

Printing Three‐Dimensional Refractory Metal Patterns in Ambient Air: Toward High Temperature Sensors

Printable and Recyclable Conductive Ink Based on a Liquid Metal with Excellent Surface Wettability for Flexible Electronics

An In-Situ Hybrid Laser-Induced Integrated Sensor System with Antioxidative Copper

Antioxidant high-conductivity copper paste for low-cost flexible printed electronics

Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond

Printing of Carbon Nanotube-Based Temperature and Bending Sensors for High-Temperature-Resistant Intelligent Textiles

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Direct Ink Writing of SiCN/RuO2/TiB2 Composite Ceramic Ink for High-Temperature Thin-Film Sensors

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Stretchable copper-nanocellulose paper heater

Room-temperature high-precision printing of flexible wireless electronics based on MXene inks