Abstract:Screen printing is the most common method used for the production of printed electronics. Formulating copper (Cu) inks that yield conductive fine features with oxidation and mechanical robustness on low-temperature substrates will open up opportunities to fabricate cost-effective devices. We have formulated a screen-printable Cu metal-organic decomposition (MOD) ink comprising Cu formate coordinated to 3-(diethylamino)-1,2-propanediol, a fractional amount of Cu nanoparticles (CuNPs), and a binder. This simple formulation enables ∼70-550 μm trace widths with excellent electrical [∼8-15 mΩ/□/mil or 20-38 μΩ·cm] and mechanical properties with submicron-thick traces obtained by intense pulse light (IPL) sintering on Kapton and poly(ethylene terephthalate) (PET) substrates. These traces are mechanically robust to flexing and creasing where less than 10% change in resistance is observed on Kapton and ∼20% change is observed on PET. Solderable Cu traces were obtained only with the combination of the Cu MOD precursor, CuNP, and polymer binder. Both thermally and IPL sintered traces showed shelf stability (<10% change in resistance) of over a month in ambient conditions and 10-70% relative humidity, suitable for day-to-day fabrication. To demonstrate utility, light-emitting diodes (LEDs) were directly soldered to IPL sintered Cu traces in a reflow oven without the need for a precious metal interlayer. The LEDs were functional not only during bending and creasing of the Cu traces but even after 180 min at 140 °C in ambient air without losing illumination intensity. High definition television antennas printed on Kapton and PET were found to perform well in the ultrahigh frequency region. Lastly, single-walled carbon nanotube-based thin-film transistors on a silicon wafer were fabricated with a screen-printed Cu source and drain electrodes, which performed comparably to silver electrodes with mobility values of 12-15 cm2 V-1 s-1 and current on/off ratios of ∼105 and as effective ammonia sensors providing parts per billion-level detection.

A low-cure-temperature copper nano ink for highly conductive printed electrodes

A New Copper Ink With Low Sintering Temperature For Flexible Substrates

Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature.

Control of chemical kinetics for sub-10 nm Cu nanoparticles to fabricate highly conductive ink below 150 °C

Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics

Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics

Nano-organic silver composite conductive ink for flexible printed circuit

Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

Self-reducible copper ion complex ink for air sinterable conductive electrodes

A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology

One step preparation of copper–silver self-catalyzed hybrid conductive ink with reduced sintering temperature for flexible electronics

The Synthesis of Copper Nanoparticles for Printed Electronic Materials Using Liquid Phase Reduction Method

Mixed Ink of Copper Nanoparticles and Copper Formate Complex with Low Sintering Temperatures

Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond

Printable Copper Sensor Electronics for High Temperature

Fabrication of Stabilized and Dispersive Copper Nanowires Ink

Copper Nanoplates for Printing Flexible High-Temperature Conductors

Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces

Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Rapid Low Temperature Sintering in Air of Copper Submicron Particles with Synergistic Surface-Activation and Anti-Oxidative Protection