Fabrication of Stabilized and Dispersive Copper Nanowires Ink

Meng Yuan,Jing Xu,Qiang Chen,Dongsheng Li,Deren Yang

DOI: https://doi.org/10.1007/s10854-018-9637-4

2018-01-01

Journal of Materials Science Materials in Electronics

Abstract:In this paper, an organic stabilized and dispersive Cu nanowires (NWs) ink was proposed. We investigated and determined the recipe of the expectant ink framework and proved its usage as flexible transparent conductive films. The influences of main solutes on stability and dispersity of the ink were discussed detailedly. The stability was evaluated by the sedimentation time of the ink and the dispersity was weighed by the morphology of the freely-dispersed Cu NWs ink on substrates. The electric properties of the following conductive films were obatained by Hall effect measurement system. A simple and efficient method has carried out for fabricating the transparent electrodes from the prepared Cu NWs ink. These electrodes possessed a good performance in both conductivity and transmittance, which verified the pragmaticality of suggested Cu NWs ink as well. Typically, the sheet resistances of the processed electrodes made by the plasma enhanced chemical vapor deposition technique were about 80 Ω·sq−1, and the light transmittances at 550 nm were over 80%. The figures of merit of them were over 10−3 Ω−1.