Abstract:The development of next generation materials and manufacturing technologies is critical for increasing industrial competitiveness, improving economic strength, and driving economy-wide decarbonization. Thermal and/or electrical conductivity-enhanced materials have been demonstrated as promising elements for the decarbonized industry sector with a wide variety of applications. High thermal conductivity materials enable new capabilities for the applications on sensors, detectors, and accelerators. The sluggish conduction cooling rate of conventional materials, such as copper, aluminum, or graphite, hinders the application of the cryogenic cooling systems. Graphene are two-dimensional nanocarbon materials with excellent physical and chemical properties, such as thermal and electronic conductivity, high mechanical strength, large specific surface area. The intrinsic physiochemical properties of graphene and a metal (copper) matrix, combined with advanced fabrication techniques, could tailor graphene-copper hybrid properties and make the hybrid as ideal thermal strap materials for conduction cooling systems. In this work, Faraday Technology Inc. and Utah State University will discuss an efficient, scalable, manufacturing-ready approach to produce high conductive graphene-copper hybrid foils/coatings and demonstrate their applications in thermal straps for conduction cooling, as well as in electronic devices as low resistance electrical pathways. The innovative electro-codeposition manufacturing process is based on the use of pulsed electric fields, for controlled, reproducible, scalable deposition of Cu and graphene materials simultaneously to form incorporated graphene-Cu hybrid foils. The graphene composition in the hybrid foils was confirmed by Raman spectrometry. The thermal conductivity of fabricated Cu-Graphene foil was ~50% higher than that of commercial Cu foil. Currently. we are scaling up the fabrication process for large scale production of graphene-copper hybrid foils for the thermal strap application. In summary, a scalable manufacturing process for synthesizing high conductive graphene-copper hybrids has been demonstrated. The work will be continued on thermal straps fabrication and performance evaluation, as well as other applications demonstration, such as low resistance backplanes for electronic devices. Acknowledgements: The financial support of DOE SBIR program through grant No. DE-SC0021676 (Phase I&II) is acknowledged.

High‐Temperature Hybridized Copper‐Boron Nitride Materials from Additive Manufacturing

High‐Temperature Oxidation‐Resistant Printed Copper Conductors

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

High‐Temperature Copper–Graphene Conductors via Aerosol Jetting

Copper Nanoplates for Printing Flexible High-Temperature Conductors

Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics

Cold metal transfer-based wire arc additive manufacturing of pure copper with ultra high tensile strength

Highly Thermally Conductive Polybenzoxazine Composites Based on Boron Nitride Flakes Deposited with Copper Particles

High Current Carrying and Thermal Conductive Copper-Carbon Conductors

Metal Injected Copper Carbon Nanotube Composite Material with High Thermal Conductivity and Low CTE for IGBT Power Modules

Copper nanowires embedded in boron nitride nanosheet-polymer composites with enhanced thermal conductivities for thermal management

Performance enhancement of carbon/copper composites based on boron doping

Recent Advances in the 3D Printing of Pure Copper Functional Structures for Thermal Management Devices

Additive Manufacturing of Isotropic-Grained, High-Strength and High-Ductility Copper Alloys

Fabrication of Copper Alloys as Conductive Materials via Laser Beam Powder Bed Fusion

High temperature performance of coaxial h-BN/CNT wires above 1,000 °C: Thermionic electron emission and thermally activated conductivity

Solderless Bonding with Nanoporous Copper As Interlayer for High-Temperature Applications.

Pulsed Electro-Codeposition of Graphene-Copper Hybrids with Enhanced Conductivity

Influence of Tantalum/tantalum Nitride Barriers and Caps on the High-Temperature Properties of Copper Metallization for Wide-Band Gap Applications

High conductive copper alloys for additive manufacturing

Preparation of Boron Nitride Nanosheet/Nanofibrillated Cellulose Nanocomposites with Ultrahigh Thermal Conductivity via Engineering Interfacial Thermal Resistance