Abstract:Traditionally, structural wire is characterized by a homogeneous microstructure, where the average grain size in different parts of the wire is uniform. According to the classical Hall–Petch relationship, a homogeneous polycrystalline metal can be strengthened by decreasing the average grain size since an increase in the volume fraction of grain boundaries will further impede the motion of dislocations. However, a decrease in the grain size inevitably leads to a decrease in the ductility and deformability of the material due to limited dislocation mobility. Putting a gradient microstructure into the wire has promising potential for overcoming the compromise between strength and ductility. This is proposed a new combined technology in this paper in order to obtain a gradient microstructure. This technology consists of deforming the wire in a rotating equal-channel step die and subsequent traditional drawing. Deformation of copper wire with a diameter of 6.5 mm to a diameter of 5.0 mm was carried out in three passes at room temperature. As a result of such processing, a gradient microstructure with a surface nanostructured layer (grain size ~400 nm) with a gradual increase in grain size towards the center of the wire was obtained. As a result, the microhardness in the surface zone was 1150 MPa, 770 Mpa in the neutral zone, and 685 MPa in the central zone of the wire. Such a symmetrical spread of microhardness, observed over the entire cross-section of the rod, is a direct confirmation of the presence of a gradient microstructure in deformed materials. The strength characteristics of the wire were doubled: the tensile strength increased from 335 MPa to 675 MPa, and the yield strength from 230 MPa to 445 MPa. At the same time, the relative elongation decreased from 20% to 16%, and the relative contraction from 28% to 23%. Despite the fact that the ductility of copper is decreased after cyclic deformation, its values remain at a fairly high level. The validity of all results is confirmed by numerous experiments using a complex of traditional and modern research methods, which include optical, scanning, and transmission microscopy; determination of mechanical properties under tension; and measurement of hardness and electrical resistance. These methods allow reliable interpretation of the fine microstructure of the wire and provide information on its strength, plastic, and electrical properties.

Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

Enhanced Tensile Properties And Fracture Reliability Of Cu-Based Amorphous Wires Via Pr-Doping

High Strength and High Ductility Copper Obtained by Topologically Controlled Planar Heterogeneous Structures

Design Strategy to Simultaneously Enhance Electrical Conductivity and Strength: Cold-Drawn Copper-Based Composite Wire with In-Situ Graphene

Reforming Nanostructured CuAg Alloy to Improve Ductility and Electrical Conductivity

Attaining Exceptional Electrical Conductivity in Cu-Fe Composite by Powder Rolling Strategy

Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper

Mechanisms for high strength and ultra-high electrical conductivity of Cu-3.5wt.%Ag alloy prepared by thermomechanical treatment

Fractal structure and nano-precipitates break comprehensive performance limits of CuCrZr alloys

Obtaining Symmetrical Gradient Structure in Copper Wire by Combined Processing

Microstructure and Properties of Cold Drawing Cu-2.5% Fe-0.2% Cr and Cu-6% Fe Alloys

Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Achieving high strength and high conductivity synergy through hierarchical precipitation stimulated structural heterogeneities in a Cu-Ag-Zr alloy

In-situ graphene enhanced copper wire: A novel electrical material with simultaneously high electrical conductivity and high strength

Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires

A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys

A promising structure for fabricating high strength and high electrical conductivity copper alloys

Enhanced Mechanical and Electrical Properties of Super-Aligned Carbon Nanotubes Reinforced Copper by Severe Plastic Deformation

Fabrication of a novel high-strength and high-conductivity copper-clad aluminum composite wire

Achieving superior strength and conductivity for Al-Zr-Sc wires by coupling design of deformation and ageing

Progress in Research on Nanoprecipitates in High-Strength Conductive Copper Alloys: a Review