Abstract:With the rapid development of power electronic devices, miniaturization, high-power density, and high thermal reliability have become the standard for next-generation semiconductor devices. As silicon-based materials are difficult to meet the application requirements for high power density and high-temperature operation, wide-band-gap (WBG) semiconductor, such as silicon carbide (SiC) and gallium nitride (GaN), have taken the main role. Though high-power density and high switching frequency characteristics ensured those materials can lead to high performance power devices, the excessive junction temperatures (Tj) could lead to the deterioration risk for relative packaging material. Especially the die-attach materials, which integrate power chips to substrate, are easily influenced by thermal fatigue and frequency thermal cycling environment. Some new technologies, such as. high-temperature brazing materials, transient liquid phase bonding technology, and sintered silver (Ag) technology, have been investigated. All those materials have their own drawbacks such as serious processing condition, high risk of fragile, and price costing. In comparison, metal copper (Cu) sinter paste is considered an ideal wide-bandgap semiconductor connection material due to its cost-effectiveness, excellent thermoelectric properties, and good thermal reliability. However, for efficient sintering of Cu paste, most research applied pressure, reductive atmosphere and/or high processing temperature, which limited the widely application of Cu sinter paste for high density power device interconnection [1]–[3]. Therefore, it is necessary to study the bonding strength, bonding mechanism, and reliability of copper paste on metal plates in high-power devices. To address these issues, this paper reports a non-pressure Cu sinter paste interconnection technology with nano-particles and reductive solvent included. The paste could form efficient sintering in N2. So that high reliable interconnection between chips and substrate could be achieved. The shear strength, SEM and EDS were applied on sintered interconnection for evaluation. And the result showed that the Cu sinter paste showed good bondability on both Cu and Ag surface, and the key factors for high rank sintering were explored. This work provides both experimental and theoretical research for creating high-strength connections by sintered Cu pastes, and extended the potential of Cu sinter paste in high density power devices.

Anti-oxidative Copper Nanoparticle Paste for Cu–Cu Bonding at Low Temperature in Air

Copper Submicron Particle Pastes with Organic Compounds As Anti-Oxidative Additive for Cu–Cu Bonding in Air

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Synthesis and Characterization of Highly-Dispersed Copper Submicron Particles for Low Temperature Sintering Joints

Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Non-Pressure Cu Sinter Paste for High Density Power Device Interconnection

Ambient Aqueous-Phase Synthesis of Copper Nanoparticles and Nanopastes with Low-Temperature Sintering and Ultra-High Bonding Abilities

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition

A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance

In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics

A Novel Cu@Ag Nano Paste with Low Porosity for Rapidly Sintering in Air Condition

Formation of Cu-Cu Joints with High Shear Strength and High Reliability in Air Atmosphere

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Nano-Cu Paste Sintering in Pt-catalyzed Formic Acid Vapor for Cu Bonding at a Low Temperature

A Low-Temperature Cu-to-Cu Interconnection Method by Using Nanoporous Cu Fabricated by Dealloying Electroplated Cu–Zn

A highly reliable die bonding approach for high power devices by low temperature pressureless sintering using a novel Cu nanoparticle paste

Superb Sinterability of the Cu Paste Consisting of Bimodal Size Distribution Cu Nanoparticles for Low-Temperature and Pressureless Sintering of Large-Area Die Attachment and the Sintering Mechanism

Ultra-low Temperature Sintering of Cu@Ag Core-Shell Nanoparticle Paste by Ultrasonic in Air for High-Temperature Power Device Packaging.

Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging