Abstract:With the rapid development of the third-generation semiconductors SiC and GaN,traditional packaging materials,such as Si-based lead-free solder,cannot satisfy the requirements of high-power density and high-temperature loading in power electronic devices any more.Nowadays,the joints packaged by Cu nanoparticle sintering technique can not only be bonded at low-temperature and then serve at high-temperature,but also exhibit excellent thermal conductivity,electrical conductivity and relatively lower cost comparing with Ag nanoparticles.Thus,more and more attention has been attracted in the field of Cu nanoparticle sintering technique for power electronic packaging,which makes Cu nanoparticles become one of the most potential high-temperature-resistant packaging and interconnection materials.In this work,the current research progress of Cu nanoparticle sintering technique was summarized,including the fabrication of Cu nanoparticle pastes,the factors affecting the performance of sintered joints and the reliability of joints.Meanwhile,the oxidation behavior as well as the anti-oxidation methods of Cu nanoparticle were introduced.Besides,the high-temperature working reliability and failure mechanism of Cu nanoparticle sintered joints were discussed.This review aims to promote the application of low-cost Cu nanoparticle sintering technique for high-performance and high-reliability power electronic packaging.

Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics

Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging

Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging

Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

Anti-oxidative Copper Nanoparticle Paste for Cu–Cu Bonding at Low Temperature in Air

Copper Submicron Particle Pastes with Organic Compounds As Anti-Oxidative Additive for Cu–Cu Bonding in Air

A Review Of Sintering-Bonding Technology Using Ag Nanoparticles For Electronic Packaging

Rapid and Low Temperature Sintering Bonding Using Cu Nanoparticle Film for Power Electronic Packaging

Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Micro-Scaled Ag_2O Composite Paste

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Synthesis of Size-Controlled Pure Copper Nanoparticles for Packaging Interconnect

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Research Progress of Cu Nanoparticle Sintering Technology for Power Electronic Packaging