Abstract:The field of flexible electronics has rapidly expanded over the last decades, pioneering novel applications, such as wearable and textile integrated devices, seamless and embedded patch-like systems, soft electronic skins, as well as imperceptible and transient implants. The possibility to revolutionize our daily life with such disruptive appliances has fueled the quest for electronic devices which yield good electrical and mechanical performance and are at the same time light-weight, transparent, conformable, stretchable, and even biodegradable. Flexible metal oxide semiconductor thin-film transistors (TFTs) can fulfill all these requirements and are therefore considered the most promising technology for tomorrow's electronics. This review reflects the establishment of flexible metal oxide semiconductor TFTs, from the development of single devices, large-area circuits, up to entirely integrated systems. First, an introduction on metal oxide semiconductor TFTs is given, where the history of the field is revisited, the TFT configurations and operating principles are presented, and the main issues and technological challenges faced in the area are analyzed. Then, the recent advances achieved for flexible n-type metal oxide semiconductor TFTs manufactured by physical vapor deposition methods and solution-processing techniques are summarized. In particular, the ability of flexible metal oxide semiconductor TFTs to combine low temperature fabrication, high carrier mobility, large frequency operation, extreme mechanical bendability, together with transparency, conformability, stretchability, and water dissolubility is shown. Afterward, a detailed analysis of the most promising metal oxide semiconducting materials developed to realize the state-of-the-art flexible p-type TFTs is given. Next, the recent progresses obtained for flexible metal oxide semiconductor-based electronic circuits, realized with both unipolar and complementary technology, are reported. In particular, the realization of large-area digital circuitry like flexible near field communication tags and analog integrated circuits such as bendable operational amplifiers is presented. The last topic of this review is devoted for emerging flexible electronic systems, from foldable displays, power transmission elements to integrated systems for large-area sensing and data storage and transmission. Finally, the conclusions are drawn and an outlook over the field with a prediction for the future is provided.

Ultrathin Transistors and Circuits for Conformable Electronics

Ultra-thin transistors and circuits for conformable electronics

Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Challenges and emerging opportunities in transistor-based ultrathin electronics: design and fabrication for healthcare applications

Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible Electronics

Ultra-thin chips for high-performance flexible electronics

Printed transistors made of 2D material-based inks

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Stretchable and Foldable Silicon Integrated Circuits

Ultrathin Conformal Devices for Precise and Continuous Thermal Characterization of Human Skin

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

A Review of the Progress of Thin-Film Transistors and Their Technologies for Flexible Electronics

Compact Modeling of Thin-Film Transistors for Flexible Hybrid IoT Design

Metal oxide semiconductor thin-film transistors for flexible electronics

Sub-180-nanometer-thick ultraconformable high-performance carbon nanotube-based dual-gate transistors and differential amplifiers

Batches of ultra-thin transistors made from 2D materials

Thin-film transistors for large-area electronics

Ultrathin, Transferred Layers of Thermally Grown Silicon Dioxide As Biofluid Barriers for Biointegrated Flexible Electronic Systems

Review of Ultra-Thin and Skin-Like Solid Electronics

Intrinsically Stretchable Electronics with High Performance and Large Integration Scale