Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Mechanics of stretchable inorganic electronic materials

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Stretchable electronics based on inorganic semiconducting materials

ChemInform Abstract: Stretchable, Curvilinear Electronics Based on Inorganic Materials

Stretchable and Foldable Silicon Integrated Circuits

Mechanics Designs for Stretchable Inorganic Electronics

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Review on stretchable and flexible inorganic electronics

Inorganic Semiconducting Materials for Flexible and Stretchable Electronics

Mechanics of Stretchable Electronics

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics.

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Morphological/nanostructural control toward intrinsically stretchable organic electronics.

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

Stretchability of Encapsulated Electronics