Abstract:Hybrid 3D printed rigidity‐programmable substrate/liquid metal 3D circuits are used to develop a stretchable pulse sensor, which effectively mitigates the rigid‐flexible mismatch challenge in stretchable electronics and streamlines circuit design. Stretchable electronics have the unique capability of 3D (three dimensional) deformation, overcoming the brittleness of traditional inorganic electronics. However, during large deformations, different scale strains between the rigid and stretchable components lead to mismatch, causing interconnect failures. Therefore, the development of the rigidity‐programmable substrate with effective strain shielding capabilities has become a research hotspot. Furthermore, the exponential growth in electronic density presents challenges in the circuit design of stretchable electronics. The urgent need is to develop highly integrated stretchable electronic systems. In this study, a highly integrated stretchable pulse sensor with effective strain shielding capabilities using hybrid 3D printing technology is developed, which comprises electronic chips, a rigidity‐programmable substrate/encapsulation layer printed by using PSC (polydimethylsiloxane/silica‐nanoparticles composite)‐based ink, and LM (liquid metal)‐based 3D circuits. First, the PSC‐based ink is optimized to enhance the strain shielding effectiveness of the rigidity‐programmable substrate. Meanwhile, 3D printing parameters are optimized to achieve high printing precision with minimum line widths below 100 μm. The resulting stretchable pulse sensor demonstrated good mechanical and electrical stability under complex 3D deformations, including bending, twisting, and stretching. The PSC region strain of the sensor is only ≈2% when the global strain is up to ≈65%, which exhibited effective strain shielding capabilities.

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Direct Fabrication of Stretchable Electronics on a Polymer Substrate with Process‐Integrated Programmable Rigidity

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Soft Elastomers with Ionic Liquid‐Filled Cavities As Strain Isolating Substrates for Wearable Electronics

Elastomeric Substrates with Embedded Stiff Platforms for Stretchable Electronics

Elastomers with Microislands as Strain Isolating Substrates for Stretchable Electronics

A Strain-Isolation Design for Stretchable Electronics

Soft elastomeric composite materials with skin-inspired mechanical properties for stretchable electronic circuits.

Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Mechanics of stretchable inorganic electronic materials

Fabric-based stretchable electronics with mechanically optimized designs and prestrained composite substrates

Stiffness and Interface Engineered Soft Electronics with Large-Scale Robust Deformability

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Synthesis of a Photo‐Crosslinkable Elastomer for Stretchable Electronics and Its Use in Strain‐Insensitive Pressure Sensors

Elastic Substrates for Stretchable Devices

Hybrid Printed Rigidity‐Programmable Substrate/Liquid Metal 3D Circuits Toward Stretchable Electronics