Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Dae‐Hyeong Kim,Yun‐Soung Kim,Jian Wu,Zhuangjian Liu,Jizhou Song,Hoon‐Sik Kim,Yonggang Y. Huang,Keh‐Chih Hwang,John A. Rogers
DOI: https://doi.org/10.1002/adma.200990139
IF: 29.4
2009-01-01
Advanced Materials
Abstract:The cover shows a silicon integrated circuit on a paper substrate. The system consists of ultrathin devices electrically and mechanically interconnected with stretchable, serpentine ribbons. A low modulus elastomeric adhesive isolates the circuit from strains associated with bending and folding the paper. This strategy provides a route to high quality electronics on paper, vinyl, leather and other unusual substrates, as reported by John Rogers and co-workers on p. 3703.
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