Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Stretchable and Foldable Silicon Integrated Circuits

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Soft Elastomers with Ionic Liquid‐Filled Cavities As Strain Isolating Substrates for Wearable Electronics

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

A Strain-Isolation Design for Stretchable Electronics

Mechanics of Noncoplanar Mesh Design for Stretchable Electronic Circuits

Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Mechanics of stretchable inorganic electronic materials

Monolithic Optical Microlithography of High-Density Elastic Circuits

Fabric-based stretchable electronics with mechanically optimized designs and prestrained composite substrates

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Soft elastomeric composite materials with skin-inspired mechanical properties for stretchable electronic circuits.

Ultra-thin transistors and circuits for conformable electronics